WMSIC Electronic Components

XTX XT27G02BTSIGA

ModelXT27G02BTSIGA
PackageTSOP48 12X20X1.2mm
BrandXTX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XTX XT27G02BTSIGA
Type
XTX
Minimum package
960 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XTX
Electronic Component
XT27G02BTSIGA
Electronic Component
1
Package
TSOP48 12X20X1.2mm
Electronic Component
EEPROM
Electronic Component
2.122g
Electronic Component
1
Features
Built-in (ECC)
Electronic Component
BM0264826353
Electronic Component
2Gbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Electronic Component
Electronic Component
Electronic Component
960
(Tw)
300us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XT27G02BTSIGA 2Gbit存储器件产品概述

一、产品定位与核心特性

XT27G02BTSIGA是芯天下(XTX)推出的一款2Gbit容量非易失性存储器件,主要面向对容量、可靠性和宽温适应性有明确需求的工业级及消费电子领域。作为该品牌中端存储方案的代表,其核心特性聚焦于「高集成度、宽电压兼容、工业级可靠性」,可直接适配从物联网终端到工业控制设备的多样化存储场景,无需额外复杂的电源调节或温度防护设计。

二、关键参数详解

该器件的核心参数围绕「存储性能、环境适应性、可靠性」三大维度设计,具体如下:

  1. 存储容量:2Gbit(等效256MB)—— 可支撑固件存储、日志记录、多媒体数据缓存等典型需求,避免因容量不足导致的频繁扩容或分块存储;
  2. 工作电压范围:2.7V~3.6V—— 覆盖主流嵌入式系统的电源输出(如3.3V为多数MCU/SoC的标准电压,2.7V可兼容低电压场景),减少电源转换电路的复杂度与成本;
  3. 写周期时间(Tw):300us—— 单次写操作耗时稳定,可满足实时数据写入需求(如传感器节点的周期性数据采集),避免因写速度过慢导致的数据丢失;
  4. 数据保留(TDR):10年—— 非易失性存储的核心指标,10年数据保留能力可支撑设备全生命周期内的关键数据存储(如工业设备的校准参数、消费电子的用户配置);
  5. 工作温度范围:-40℃~+85℃—— 符合工业级温度标准,可在户外传感器、工厂控制柜等 harsh 环境下稳定运行,无需额外温控措施。

三、封装与可靠性设计

XT27G02BTSIGA采用TSOP-48封装(薄型小外形封装),该封装具有以下实际优势:

  • 体积紧凑:厚度薄、引脚密度适中,适合对PCB空间要求严格的小型化设备(如物联网网关、便携式工业仪器);
  • 散热性能:TSOP封装的散热面积较传统封装更优,可降低存储器件在高负载写入时的温度累积,提升长期稳定性;
  • 兼容性:48引脚的TSOP封装为行业通用标准,可与多数主流MCU/SoC的接口兼容,简化电路设计与PCB布线。

此外,产品的可靠性设计还体现在:

  • 宽温范围内电气性能无衰减:在-40℃低温及+85℃高温下,写周期时间、数据保留能力无明显波动;
  • 抗干扰优化:针对工业环境的电磁干扰(EMI)做了电路设计调整,减少数据写入/读取时的错误率。

四、典型应用场景

结合参数特性,该器件适用于以下场景:

  1. 工业控制领域:PLC(可编程逻辑控制器)的固件存储、传感器节点的历史数据日志、工业机器人的状态记录;
  2. 消费电子领域:机顶盒的固件与多媒体缓存、路由器的配置数据与日志、智能电视的应用存储;
  3. 物联网终端:智能电表的计量数据存储、环境监测传感器的实时数据缓存、智能门锁的用户配置与日志;
  4. 车载电子(扩展场景):可用于车载信息娱乐系统的非关键数据存储(如音乐缓存、导航地图更新)。

五、产品选型与应用优势

与同类2Gbit存储器件相比,XT27G02BTSIGA的核心优势在于:

  • 成本与性能平衡:2Gbit容量覆盖多数中端存储需求,无需选择更高容量器件导致成本浪费;
  • 宽电压适应:2.7~3.6V电压范围可兼容不同品牌MCU的电源输出,减少电源电路设计工作量;
  • 工业级可靠性:10年数据保留+宽温范围,适合对可靠性要求高的工业场景,降低设备维护成本;
  • 国产厂商支持:芯天下作为国内存储器件厂商,提供完善的技术支持与样品服务,便于客户快速验证与量产。

综上,XT27G02BTSIGA是一款「容量适中、可靠性强、适配性广」的中端存储方案,可满足工业、消费电子、物联网等多领域的存储需求,是替代进口同类器件的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.