WMSIC Electronic Components

XTX PN27G04ABGITG

ModelPN27G04ABGITG
PackageBGA24 6x8mm
BrandXTX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XTX PN27G04ABGITG
Type
XTX
Minimum package
377 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XTX
Electronic Component
PN27G04ABGITG
Electronic Component
1
Package
BGA24 6x8mm
Electronic Component
NAND FLASH
Electronic Component
1.435g
Electronic Component
1
Features
ECC; positions
Electronic Component
BM0264826339
Electronic Component
4Gbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
50uA
Interface Type
Parallel
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PN27G04ABGITG 产品概述

一、产品简介

PN27G04ABGITG 是 XTX(芯天下)推出的一款 4Gbit 并行 SLC NAND 闪存器件(PN27G04A 系列)。器件采用 8bit 并行接口,单芯片原始容量 4Gbit(512MB),页大小为 4096 字节,块大小为 256K 字节(每块 64 页),适用于需要高可靠性与长寿命的非易失性存储场景,如固态文件存储、语音录音、图像与多媒体文件存储等。

二、主要性能指标

  • 存储容量:4Gbit(512MB)
  • 接口类型:并行(8-bit)
  • 工作电压:2.7V ~ 3.6V
  • 页写入时间 (Tpp):300 μs(典型)
  • 写周期时间 (Tw):25 ns
  • 块擦除时间 (tBE):3.5 ms(典型)
  • 数据保留 (TDR):10 年
  • 工作温度:-40 ℃ ~ +85 ℃
  • 待机电流:50 μA

三、封装与物理特性

封装形式为 BGA24,外形尺寸 6 × 8 mm,适合空间受限且需高密度集成的嵌入式系统与消费电子设备。并行接口便于与现有 NAND 控制器或定制 FPGA/MCU 总线直接对接。

四、功能特性

  • 硬件写保护(WP)功能,提升误写防护能力;
  • 读缓存(Read Cache)功能,提高顺序读取性能;
  • 8-bit ECC 硬件纠错支持,增强数据完整性;
  • 软件复位功能,便于异常恢复与系统管理;
  • 复制回写(Copyback)功能,支持块内数据搬移以优化擦写与垃圾回收。

五、典型应用与设计建议

适用于固态文件储存模块、语音记录设备、数码相机与工业图像采集等高可靠场景。设计时建议:

  • 主控侧实现 ECC 校验与坏块管理(BMT)、磨损均衡(Wear Leveling);
  • 做好电源滤波与上电/断电序列控制,避免擦写/编程中断导致的数据损坏;
  • 合理使用硬件写保护与软件复位以提升系统鲁棒性;
  • 利用读缓存与复制回写提升吞吐与擦写效率。

六、可靠性与注意事项

PN27G04ABGITG 为 SLC 器件,具备较高擦写寿命与数据保持能力,但在长期设计中仍需考虑磨损管理与定期备份。建议按照产品手册中的时序与操作规范接入并测试,确保满足目标应用的可靠性要求。

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