Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XTX XT26G01DLAIGA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XTX XT26G01DLAIGA
- Type
- XTX
- Minimum package
- 570 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XTX
- Electronic Component
- XT26G01DLAIGA
- Electronic Component
- 1
- Package
- LGA8 6x5mm
- Electronic Component
- NAND FLASH
- Electronic Component
- 0.891g
- Electronic Component
- 1
- Features
- OTP and; ECC; positions
- Electronic Component
- BM0264826335
- Electronic Component
- 1Gbit
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.7V~3.6V
- Current
- 70uA
- Interface Type
- SPI
- Electronic Component
- 6
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XT26G01DLAIGA 产品概述
一、产品简介
XT26G01DLAIGA 是 XTX（芯天下）推出的一款高性能 SPI NAND Flash，容量 1 Gbit（128 Mbyte），支持标准 SPI 以及双线/四线 I/O 模式。器件工作电压范围为 2.7V～3.6V，最高时钟频率可达 120 MHz，集成多项硬件与软件保护机制，适合对容量、成本和可靠性有较高要求的嵌入式存储应用。
二、主要规格
- 存储容量：1 Gbit（128 Mbyte）
- 接口类型：SPI，支持 Dual/Quad I/O
- 时钟频率（fc）：最高 120 MHz
- 工作电压：2.7V ～ 3.6V
- 页写入时间（Tpp）：360 μs
- 块擦除时间（tBE）：3.5 ms
- 数据保持（TDR）：10 年
- 擦写寿命：60,000 次
- 工作温度：-40℃ ～ +85℃
- 待机电流：70 μA
- 封装：LGA8 6×5 mm
三、关键功能特性
- 硬件写保护（WP）功能，有效防止误写
- 读缓存（Read Cache）提高顺序读性能
- OTP 区域写保护与锁定，适合存放校准参数或密钥
- 内建 ECC 纠错，提升数据可靠性
- 软件复位、写使能锁存（WEL）与软件写保护支持
- 复制回写（Copy-back）功能，便于数据移动与管理
四、性能与可靠性
高达 120 MHz 的 SPI 时钟配合 Dual/Quad I/O 能显著提升读写吞吐；360 μs 的页写入与 3.5 ms 的块擦除时间在同类器件中具有竞争力。器件通过内置 ECC 保证在 NAND 误码环境下的数据完整性；60,000 次擦写寿命与 10 年数据保持适合工业级与消费级长期使用场景。
五、封装与系统集成建议
LGA8 6×5 mm 小体积封装，便于在空间受限的 PCB 上布局。设计时建议：
- 在 VCC 和 GND 之间放置足够去耦电容（如 0.1 μF 与 1 μF）
- 合理使用 WP/RESET 引脚实现硬件保护与复位策略
- 主机侧需支持 SPI NAND 的 ECC 与 Copy-back 命令集，或在软件层集成 ECC 处理
- 遵循页/块对齐的擦写与寻址规则以延长寿命
六、典型应用
适用于固件存储、系统引导（boot）、日志记录、物联网终端、机顶盒、网络设备、汽车电子（符合温度范围）及各类消费电子与工业控制系统。
七、总结
XT26G01DLAIGA 以 1 Gbit 容量、120 MHz SPI 性能、完善的硬件/软件保护和工业级可靠性，成为对成本、空间与可靠性有综合需求的存储选型优先项。针对具体应用，建议结合主控的 ECC 能力与系统电源设计进行验证与优化。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
