WMSIC Electronic Components

XTX XT27Q08ABSIGA

ModelXT27Q08ABSIGA
PackageBGA63 11x9x0.88mm
BrandXTX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XTX XT27Q08ABSIGA
Type
XTX
Minimum package
210 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XTX
Electronic Component
XT27Q08ABSIGA
Electronic Component
1
Package
BGA63 11x9x0.88mm
Electronic Component
NAND FLASH
Electronic Component
2.235g
Electronic Component
1
Features
ECC; positions
Electronic Component
BM0264826338
Electronic Component
8Gbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~1.95V
Current
100uA
Interface Type
Parallel
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XT27Q08ABSIGA 产品概述

XT27Q08ABSIGA 是 XTX(芯天下)推出的一款高可靠性 SLC NAND Flash 器件,容量为 8Gbit,面向需要高耐久性与长期数据保持的嵌入式和存储系统。器件采用并行接口、1.8V 供电,并在性能与可靠性之间实现平衡,适合固态文件存储、语音/图像记录、工业数据记录等高密度非易失性存储场景。

一、主要规格

  • 存储容量:8Gbit(SLC)
  • 接口类型:Parallel(并行)
  • 工作电压:1.7V ~ 1.95V(典型 1.8V)
  • 工作温度范围:-40℃ ~ +85℃
  • 待机电流:100 μA
  • 数据保留(TDR):10 年

二、组织结构与页面/块信息

  • 器件组织: (4096 + 256) 字节 × 64 页 × 4096 块
  • 每页大小:4352 字节(主区 4096B + OOB 256B)
  • 每块大小: (256K + 16K) 字节(即 64 页/块)
    该组织结构便于基于页/块的编程与擦除管理,适合传统 NAND 控制器设计。

三、性能指标

  • 写周期时间 (Tw):25 ns(写入周期相关参数)
  • 页写入时间 (Tpp):300 μs(单页编程)
  • 块擦除时间 (tBE):3.5 ms(单块擦除)
  • 纠错要求:需要 8 位 ECC 支持(设计时需在控制器端实现相应 ECC 能力)
    读写及擦除过程处于性能与数据完备性的权衡区间,可满足嵌入式系统对吞吐与实时性的常规需求。

四、功能特性

  • 硬件写保护(Hardware WP)功能,提升数据安全性
  • 读缓存功能(Read Cache),改善连续读取性能
  • ECC 纠错功能(需 8 位 ECC 支持),提高读数据可靠性
  • 软件复位功能(Software Reset),便于系统异常恢复
  • 复制回写(Copy-back Write)功能,支持块内数据移动以减少主机传输负担

五、应用场景与设计建议

适用:固态文件存储、语音记录、图像文件存储、工业记录仪、可穿戴与车载设备等需要长期保存和高写入可靠性的场景。
设计建议:

  • 供电与时序:保证 1.8V 电源稳压、良好去耦,满足器件时序要求。
  • ECC 与坏块管理:控制器端需实现至少 8 位 ECC,并配合坏块管理与磨损均衡算法以延长寿命。
  • 熔断与保护:启用硬件写保护和软件复位以提升数据完整性与系统鲁棒性。
  • 散热与布局:BGA63 封装(11×9×0.88 mm)需合理布线与热量管理,确保在 -40℃~+85℃范围内可靠工作。

XT27Q08ABSIGA 以其 SLC 器件的高可靠性与工业级温度范围,结合硬件写保护、读缓存与复制回写等功能,为需要长期数据保持与高可靠写入的系统提供了稳健的存储解决方案。若需引脚定义、电气时序图或参考 PCB 布局建议,可进一步索取完整数据手册。

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