WMSIC Electronic Components

XHSC HC32L130F8UA-QFN32TR HC32L130F8UA

ModelHC32L130F8UA-QFN32TR
PackageQFN-32-EP(4x4)
BrandXHSC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
XHSC HC32L130F8UA-QFN32TR
Type
XHSC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XHSC
Electronic Component
HC32L130F8UA-QFN32TR
Electronic Component
1
Package
QFN-32-EP(4x4)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0g
CPU
32 Bit
CPU
ARM Cortex-M0+
Electronic Component
1
Electronic Component
BM0152282229
CPU
48MHz
Electronic Component
Electronic Component
Electronic Component
5000
Electronic Component
64KB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:HC32L130F8UA-QFN32TR

1. 简介

HC32L130F8UA-QFN32TR是一款基于ARM Cortex-M0架构的单片机,旨在为嵌入式应用提供高性能、低功耗的解决方案。该微控制器特别适合需要中小规模控制的场合,如智能家居、工业控制、传感器网络等。它不仅具有丰富的外设接口,还在功耗方面做了精细优化,使其在各种应用场合中具有优越的表现。

2. 主要特性

  • 核心架构:HC32L130F8UA基于ARM Cortex-M0内核,支持主频高达48MHz,确保运行速度能够满足大多数实时应用需求。
  • 存储资源:该单片机配备8KB的SRAM和64KB的Flash存储,适合简单到中等复杂度的控制和数据处理任务。
  • 封装形式:采用QFN-32(4x4 mm)封装,具有小巧的体积和轻便的重量,便于在空间受限的应用场景中安装使用。
  • 低功耗设计:HC32L130F8UA特点之一就是其低功耗特性,适用于电池供电的便携式设备,提供多种省电模式以延长设备的使用寿命。

3. 性能参数

  • 主频:最高可达48MHz
  • 内存:
    • Flash:64KB
    • SRAM:8KB
  • I/O接口:支持多达30个GPIO,可以灵活配置为输入或输出,符合多种外设的接入需求。
  • 定时器和计数器:内置多路定时器和PWM生成模块,支持更复杂的时间控制和信号生成。
  • 通信接口:提供USART、I2C和SPI等多种通信接口,能够满足不同设备间的数据通信需求。

4. 应用领域

HC32L130F8UA-QFN32TR广泛应用于以下领域:

  • 智能家居:可用于智能灯具控制、环境监测等设备,提升居住舒适性和能源管理的效率。
  • 工业自动化:适用于传感器数据采集、设备控制和故障诊断,使生产过程更加智能化。
  • 消费电子:可用于可穿戴设备和便携式电子产品,支持数据处理和实时监控功能。
  • 物联网:作为IoT设备的核心处理单元,HC32L130F8UA能够实现设备间的智能互联与数据交互。

5. 优势总结

HC32L130F8UA-QFN32TR单片机在设计上充分考虑了嵌入式应用的多样性和特殊性,尤其是在功耗和成本的优化方面表现出色。小巧的QFN封装让它在现代电子产品中占有一席之地,而高效的ARM Cortex-M0内核保证了其在处理复杂算法时的灵活性和响应速度。无论是在激烈竞争的市场中,还是在实际应用中,这款单片机都能够为设计师提供强有力的技术支持。

6. 结语

总而言之,HC32L130F8UA-QFN32TR凭借其卓越的性能、丰富的功能和广泛的应用范围,成为了一款非常理想的选择。无论您是从事新产品开发,还是需要进行现有系统的升级改造,这款单片机都将为您提供足够的支持和灵活性,助力您的项目顺利实施。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.