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YAGEO CC0201KRX7R8BB103 MLCC CC0201KRX7R8BB103
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YAGEO CC0201KRX7R8BB103
- Type
- 0201
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YAGEO
- Electronic Component
- CC0201KRX7R8BB103
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0257676724
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CC0201KRX7R8BB103 产品概述
一、产品简介
CC0201KRX7R8BB103 为国巨（YAGEO）系列多层陶瓷贴片电容（MLCC），额定容量 10 nF（103），容差 ±10%（K），额定电压 25 V，温度特性 X7R。封装标注 0201（用户提供信息中注明为 0603 公制），适用于对体积与布版密度要求极高的消费电子与工业产品中作为旁路、滤波和耦合电容使用。
二、主要特性
- 容值：10 nF（±10%）
- 额定电压：25 V DC
- 温度系数/介质：X7R（-55°C ~ +125°C 下容值变化一般在 ±15% 范围）
- 封装：0201（超小型贴片）
- 品牌：YAGEO（国巨），符合 RoHS 要求
- 低漏电、低等效串联电阻（ESR），适合一般去耦与中频滤波应用
三、典型应用场景
- 电源旁路与去耦：在 MCU、电源管理芯片周围用于抑制高频噪声
- 信号链的耦合/去耦：用于模拟前端、ADC 输入滤波
- 移动设备、可穿戴与物联网模块中用于节省 PCB 面积
- 贴片化高密度电路板、通讯设备与消费电子
四、使用与设计建议
- 直流偏压效应：X7R MLCC 在加直流电压时会出现显著电容下降，设计时按实际工作电压验证有效电容，必要时采用更大名义容值或更高额定电压件。
- 降额与温度：建议在靠近额定电压下适度降额使用，考虑温度变化带来的容值漂移。
- PCB 布局：尽量将去耦电容靠近器件电源引脚焊盘，缩短回流路径；0201 尺寸对焊盘设计和贴装精度要求高。
- 焊接工艺：可采用回流焊工艺，按厂商推荐的回流曲线控制峰值温度与保温时间，避免过度机械应力及多次回流。
五、可靠性与注意事项
- 超小封装易受机械应力与 PCB 挠曲影响，设计时应避免焊盘过大造成应力集中，必要时增加阻焊或缓冲结构。
- 在高电压或高温工况下应关注漏电与击穿风险，关键节点建议进行可靠性测试（热循环、湿热、焊接耐受性）。
- 选型时参考完整数据表的电容-电压特性曲线、温度特性和寿命评估，以确保满足系统长期稳定性需求。
六、型号说明（常见解读）
CC0201KRX7R8BB103 中可直接确认的要素包括：0201 为封装，K 表示 ±10% 容差，X7R 表示介质特性，103 表示 10 nF，额定电压信息（25 V）与制造商信息由采购或数据手册验证。购买与设计前建议下载国巨官方数据手册以获取完整参数和封装尺寸图。
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