Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XL2SI-111-24M 是由扬兴科技(YXC)生产的高性能无源晶振,专为各种电子设备提供精确的时钟信号。以下是对此产品的详细介绍。
XL2SI-111-24M 采用 SMD3225_4P 封装,这是一种小型化的表面贴装封装,适合于现代电子设备的紧凑设计。这种封装形式不仅节省了空间,还提高了生产效率和可靠性。
XL2SI-111-24M 的频率为 24 MHz,常温频差仅为 ±10 ppm,这意味着在正常操作条件下,晶振的频率偏差非常小,能够提供非常稳定的时钟信号。这种高精度使其特别适合于要求严格的应用场景,如通信设备、计算机系统和工业控制系统。
该晶振支持 -40℃ ~ +85℃ 的宽温范围,这使得它可以在各种环境条件下稳定运行,无论是在极寒还是高温条件下,都能保持其性能。这对于需要在恶劣环境中工作的设备来说,是一个非常重要的特性。
在整个工作温度范围内,XL2SI-111-24M 的频率稳定度为 ±20 ppm。这意味着即使温度变化较大,晶振的频率也不会有显著的漂移,确保设备始终保持准确的时钟信号。
该晶振的负载电容为 20 pF,这是一个相对较低的值。低负载电容可以简化外围电路的设计,并减少因电容匹配不良而引起的频率偏差问题。
XL2SI-111-24M 适用于各种通信设备,如无线路由器、基站设备和卫星通信系统。其高频率精度和稳定性保证了数据传输的可靠性和准确性。
在计算机系统中,XL2SI-111-24M 可以作为主时钟或辅助时钟,提供稳定的时钟信号,确保系统的正常运行和数据处理精度。
工业控制系统需要高可靠性和稳定性的时钟信号,XL2SI-111-24M 因其宽温范围和低频率漂移,非常适合于这种应用场景。
此外,XL2SI-111-24M 也可以用于各种消费电子产品,如智能家居设备、穿戴设备和汽车电子系统等,提供高精度的时钟信号,提高产品的性能和可靠性。
XL2SI-111-24M 采用 SMD3225_4P 封装,易于在 PCB 上进行表面贴装。其小尺寸和轻量设计使其成为现代电子产品设计中的理想选择。
由于其低负载电容,设计人员可以更容易地匹配外围电容,简化整个系统的设计过程,并减少因匹配不良而引起的问题。
扬兴科技(YXC)是一家具有多年经验的专业电子元器件制造商,严格按照国际标准进行生产和测试。XL2SI-111-24M 通过了严格的质量控制过程,确保每个产品都符合最高标准。
XL2SI-111-24M 是一款高性能无源晶振,具有高频率精度、宽温范围和低频率漂移等优异特性。其适用于各种需要稳定时钟信号的电子设备,包括通信设备、计算机系统、工业控制系统和消费电子产品。通过其易于集成的设计和简化的外围电路要求,XL2SI-111-24M 成为现代电子产品设计中的理想选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products