Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YXC XL2OI-111-25M Crystal XL2OI
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC XL2OI-111-25M
- Type
- YXC Yangxing Technology
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- XL2OI-111-25M
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.04g
- Frequency
- 25MHz
- Electronic Component
- 1
- Electronic Component
- BM0224294731
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：XL2OI-111-25M 无源晶振
1. 产品简介
XL2OI-111-25M是一款由YXC扬兴科技生产的无源晶振，其工作频率为25MHz，具有良好的频率稳定性和相对较低的负载电容。其设计采用SMD3225-4P封装，适合大规模贴片生产，广泛应用于电子设备中，对频率精度和稳定性要求较高的场合。
2. 主要规格
- 频率: 25MHz
- 负载电容: 12pF
- 频率容差: ±10ppm
- 封装形式: SMD3225-4P
- 品牌: YXC扬兴科技
3. 性能特点
高频率稳定性: XL2OI-111-25M具有±10ppm的频率容差，使其在温度变化和供电电压波动的情况下依然能够保持良好的频率稳定性。这样的特性使其非常适合需要高精度和长时间稳定性的应用。
适应性强: 该晶振的负载电容为12pF，能够兼容多种电路设计，是多种电子产品的理想选择。它可以在不同的工作环境中自如适应，因此在设计时可以灵活配合不同的接收和发射电路。
高集成度与小型化: SMD3225-4P封装的设计使得XL2OI-111-25M晶振不仅能够节省PCB空间，还可以提升生产效率，适合现代小型化电子产品的需求。其小型化特性使得该产品在物联网(IoT)、移动通信和其他嵌入式系统中愈发重要。
可靠性: 无源晶振相对于有源晶振而言，在结构上更为简单，没有内部放大电路，因此在使用过程中降低了故障率，增加了产品的整体可靠性。这一点尤其对于工业和消费电子应用至关重要。
4. 应用领域
XL2OI-111-25M主要应用于：
- 数据通信:用于网络交换设备、调制解调器以及路由器中，确保数据传输的时钟信号稳定可靠。
- 消费电子:应用于数码相机、音视频设备以及移动设备中，保障音视频的同步性与准确性。
- 工业控制:在工业自动化设备和控制系统中，作为时钟源提供精确的时间基准，提升系统的整体性能。
- 智能家居:在智能家居设备中，确保设备之间的通信稳定性和同步性。
5. 结论
XL2OI-111-25M无源晶振是兼具高性价比、高性能和高稳定性的电子元器件，适合广泛的应用场景。其设计和制造均遵循严格的行业标准，确保了其在各种电子产品中的使用可靠性和耐用性。因此，选择XL2OI-111-25M作为时钟源，是现代电子设备设计中优质、可靠的解决方案。随着电子技术和市场需求的不断发展，YXC扬兴科技将继续致力于为客户提供优质的产品与服务，推动电子工程的发展。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
