WMSIC Electronic Components

YXC XL2SI-111-8M Crystal XL2SI

YXC XL2SI-111-8M Crystal XL2SI
1 / 2

Product image

ModelXL2SI-111-8M
PackageSMD3225-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

19 specifications

Core information

Product name
YXC XL2SI-111-8M
Type
SMD3225-4P
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
XL2SI-111-8M
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.041g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0215559498
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：XL2SI-111-8M 无源晶振

概述

XL2SI-111-8M 是一种高性能无源晶振，工作频率为8MHz，具有优良的频率稳定性和相对较小的封装尺寸。该晶振采用SMD3225-4P封装形式，由YXC扬兴科技生产，符合现代电子设计对空间和性能的双重需求。由于其小巧的外形和高频率特性，XL2SI-111-8M广泛应用于各种电子设备中，如通信设备、消费电子、工业控制、汽车电子等。

主要特点

  1. 频率稳定性：XL2SI-111-8M具有±10ppm的频率稳定度，能够确保在不同环境条件下的可靠运行。更小的频率偏移使其特别适用于对时钟准确性要求高的电子应用。

  2. 贴片封装：采用SMD3225_4P封装，XL2SI-111-8M 在节省PCB空间的同时，具备较好的散热性能和电气特性。其小型化设计使其成为便携式设备的理想选择。

  3. 负载电容：该晶振的负载电容为20pF，设计适用于多种电路配置，容易与标准电路板兼容。负载电容的合理选择能够有效优化振荡性能并减少相位噪声。

  4. 无源特性：作为无源器件，XL2SI-111-8M 不需要外部电源即可稳定工作，只需通过电路连接即可。其简单的工作原理降低了设计的复杂性，提高了产品的可靠性。

应用场景

  • 通信设备：在移动通信、无线网络和卫星通信中，XL2SI-111-8M 可用作时钟源，以确保数据传输的同步和稳定。

  • 消费电子：广泛应用于智能手机、平板电脑、智能家居设备等消费电子产品中，作为时钟或频率控制元件，提供稳定的信号基准。

  • 汽车电子：在车载系统中，XL2SI-111-8M 作为导航系统、车载信息娱乐系统及其他电子控制单元（ECU）的时钟源，为各种功能提供准确的定时信号。

  • 工业控制：在自动化设备和工业控制系统中，晶振负责精确的时间控制，有助于设备的稳定运行和数据采集。

技术参数

  • 频率: 8MHz
  • 频率偏移: ±10ppm
  • 负载电容: 20pF
  • 封装类型: SMD3225-4P
  • 工作温度范围: -40°C 至 +85°C

可靠性与质量

作为由YXC扬兴科技制造的无源晶振，XL2SI-111-8M符合一系列工业标准，确保其高品质和良好的长期稳定性。公司在生产过程中严格控制每一轮生产工序，以确保出厂产品的质量。

此外，在实际应用过程中，该晶振还需与其他电路元件，如电容、电感等相结合，以优化电路设计，减少信号干扰，提高整体系统性能。

总结

XL2SI-111-8M无源晶振是一款经过精心设计与制造的高性能产品，其具备的高频率稳定性、便于集成的小型封装及广泛的应用场景，使其成为现代电子产品中不可或缺的重要组件。无论是在消费电子、通信设备还是工业控制领域，XL2SI-111-8M均展示出卓越的性能与可靠性，是电子工程师在寻求精确频率控制时的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.