WMSIC Electronic Components

YXC H1OSC-SUG-8M Crystal H1OSC

ModelH1OSC-SUG-8M
PackageHC-49S
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC H1OSC-SUG-8M
Type
YXC Yangxing Technology
Minimum package
200 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
H1OSC-SUG-8M
Electronic Component
1
Package
HC-49S
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.518g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0227584824
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
Through-hole Crystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

H1OSC-SUG-8M 产品概述

一、产品简介

H1OSC-SUG-8M 为无源直插晶体谐振器(直插晶振),工作频率为 8MHz,额定负载电容为 20pF,常温初始频差 ±20ppm,整体频率稳定度 ±30ppm(工作温度范围 -20℃ 至 +70℃)。产品封装为常见的 HC-49S 直插型,产商:YXC 扬兴科技。该器件为无源器件,需要配合 MCU 或晶振驱动电路(如 Pierce 振荡器)使用。

二、主要技术参数

  • 型号:H1OSC-SUG-8M
  • 类型:无源晶振(直插)
  • 频率:8.000 MHz
  • 负载电容:20 pF
  • 常温频差(初始容差):±20 ppm
  • 频率稳定度(温度范围内):±30 ppm
  • 工作温度:-20℃ ~ +70℃
  • 封装:HC-49S(直插/Through-hole)
  • 品牌:YXC 扬兴科技

三、应用场景

适用于各类需要 8MHz 基本时钟源的电子产品与开发平台,例如单片机(如 AVR、PIC)、通信模块、嵌入式控制器、工业控制板、消费电子与教育开发板等。HC-49S 封装便于手工焊接、样品验证与波峰焊装配。

四、使用建议与电路匹配

  • 配置方式:常见于 Pierce 振荡器结构,两端各并联接地电容以形成所需负载电容。
  • 负载电容计算:CL = (C1 × C2) / (C1 + C2) + Cstray。为方便选择,若印制板寄生电容 Cstray 约 2–5 pF,则常用 C1 = C2 ≈ 30–33 pF 可较好匹配标称 20 pF 负载要求(示例值,具体以目标电路测试为准)。
  • 驱动与阻抗:作为无源晶振,应注意振荡器电路的振幅与驱动电平,避免过驱动导致频率漂移或老化。参考所用 MCU/振荡器 IC 的晶体规格书调整电路参数。
  • PCB 布局:晶体与两侧负载电容应尽量靠近 MCU 晶振引脚,走线短且对地层完整,避免噪声耦合。接地和电源去耦良好可以提高振荡稳定性。

五、安装与注意事项

  • 安装:HC-49S 为直插式,可使用波峰或手工焊接。焊接时避免长时间高温直接加热晶体主体,避免应力。
  • 保管与清洁:避免机械冲击与扭曲引脚,焊后清洗时避免强酸碱溶剂直接侵蚀晶体封装。
  • 选型提示:该器件适合常温与一般工业级应用,若需更宽温或更高稳定度(如汽车级、航天级或高精度时钟应用),请选择相应温度等级与更严格频率规格的器件。

如需样品、规范书(Datasheet)或量产报价,请注明需求(数量、交期、特殊温度/老化要求),以便提供更详尽的技术支持与采购信息。

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