Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YXC X252024MOB4SI Crystal X252024MOB4SI
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC X252024MOB4SI
- Type
- YXC Yangxing Technology
- Minimum package
- 3000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- X252024MOB4SI
- Electronic Component
- 1
- Package
- SMD2520-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.086g
- Frequency
- 24MHz
- Electronic Component
- 1
- Electronic Component
- BM0230024963
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X252024MOB4SI 产品概述
一、产品简介
X252024MOB4SI 为 YXC（扬兴科技）出品的贴片无源晶振，封装型号 SMD2520-4P（尺寸约 2.5 × 2.0 mm），标称频率 24.000 MHz。常温频差为 ±10 ppm（25°C），全温区频率稳定度 ±20 ppm，额定负载电容 12 pF，工作温度范围 -40℃ 至 +85℃。该产品适用于对体积和频率精度有要求的嵌入式时钟源应用。
二、主要特性
- 频率：24.000 MHz（无源晶体）
- 常温频差：±10 ppm（25°C）
- 频率稳定度（含温漂）：±20 ppm（-40℃~+85℃）
- 建议负载电容：12 pF
- 封装：SMD2520-4P（贴片）
- 工作温度：-40℃ ~ +85℃
- 品牌：YXC 扬兴科技
三、典型应用
适配微控制器（MCU）系统、数字信号处理、串并口/UART、USB/以太网 PHY（需配套外部振荡电路）、消费电子、无线设备、计时/同步模块等需要稳定 24 MHz 时钟源的场合。
四、封装与布局建议
- 封装薄小，适合高密度 PCB 布局；焊盘为 4-pad 形式，请参考厂商封装图纸完成焊盘设计。
- 布局要点：将两个负载电容紧邻晶振引脚放置并靠近芯片的振荡器引脚，走线尽量短且对称；在晶振附近保留连续接地平面，避免在晶体下方布线或大面积铜皮。
- 负载电容选择：对称 C1 = C2，可按公式 C ≈ 2×(CL − Cstray) 估算。以 CL=12 pF、典型 PCB 寄生 Cstray 约 2–3 pF，建议 C1/C2 取 18–22 pF（视具体板上寄生值微调）。
五、使用与调试要点
- 作为无源晶振需配合目标芯片内置放大器/振荡电路使用，确认芯片手册中的晶体负载和驱动级数要求。
- 若振荡器启动困难或频率漂移，检查：负载电容值、焊接质量、振荡器配置/寄存器设置、是否需要串联限流电阻（部分 MCU 需加入以稳定振荡）。
- 避免过高驱动功率，长期高驱动可能加速老化。关于回流焊工艺，请遵循厂商提供的焊接曲线或 IPC/JEDEC 建议，避免超出推荐温度循环次数。
六、可靠性与品质提示
YXC 扬兴科技的晶体通常经过频差筛选与温度性能测试，建议在设计前索取完整规格书以确认：等效串联电阻（ESR）、老化率、回流焊等级与湿敏等级（MSL）等关键参数，以满足量产与可靠性要求。
七、结论
X252024MOB4SI 为一款尺寸小、频率稳定、适配工业级温区的 24 MHz 无源贴片晶振，适合对时钟精度有严格要求且空间受限的电子产品。设计时应重点匹配目标芯片的负载电容与板级布局，并参照厂方规格书进行焊接与可靠性验证，以确保系统时钟稳定可靠。若需完整规格书或样品评估，可向供应商索取产品数据手册和封装图。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
