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YXC X252016MOB4SI Crystal X252016MOB4SI
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC X252016MOB4SI
- Type
- YXC Yangxing Technology
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- X252016MOB4SI
- Electronic Component
- 1
- Package
- SMD2520-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.03g
- Frequency
- 16MHz
- Electronic Component
- 1
- Electronic Component
- BM0228712916
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X252016MOB4SI 产品概述
一、产品简介
X252016MOB4SI 是 YXC（扬兴科技）推出的一款无源贴片晶振，中心频率为 16.000MHz，采用 SMD2520-4P 封装，面向要求稳定参考时钟的微控制器、通信设备和消费电子产品。器件为无源晶体谐振器，需要配合 MCU 或专用振荡器输入端的反相器/放大器形成振荡回路。
二、主要性能与特点
- 频率：16.000MHz，适合常见 MCU/MCU 外设、UART、USB 等时序参考。
- 常温频差：±10ppm（初始精度优异，有利于高精度时钟应用）。
- 负载电容：12pF（标称值，设计外部负载电容时应按此参数校算）。
- 温度稳定度（频率稳定度）：±20ppm（-40℃ 至 +85℃ 工作区间内）。
- 工作温度范围：-40℃ ~ +85℃，适用于工业级环境。
- 封装：SMD2520-4P，小型贴片，利于高密度 PCB 布局与自动化贴装。
三、技术参数（关键参数一览）
- 型号：X252016MOB4SI
- 类型：无源晶振（贴片）
- 频率：16.000 MHz
- 常温频差：±10 ppm
- 频率稳定度（全温区）：±20 ppm
- 负载电容：12 pF
- 工作温度：-40℃ ~ +85℃
- 封装：SMD2520-4P
- 品牌：YXC（扬兴科技）
四、封装与安装建议
SMD2520-4P 为四端贴片封装，焊盘周围建议保持良好接地平面以降低杂散电容与干扰。焊接时请参考厂商提供的回流焊工艺曲线，避免因过高温度或不当回流速率影响性能。器件应贴近振荡器输入引脚放置，走线最短且对称，以提高启动性能和频率稳定性。
五、外部电路与选型建议
作为无源晶振，需与 MCU 或振荡器输入端构成反馈回路。外部负载电容 C1、C2 的选取按公式 CL = (C1·C2)/(C1+C2) + Cstray 计算；若取 C1 = C2，则近似 C ≈ 2·(CL - Cstray)。以标称 CL = 12pF、PCB 与引脚寄生电容约 2–4pF 为例，建议起始外部电容值约 14–18pF，实际值可通过频率校准调整。布板时应保证地线完整、走线短并避免强干扰源邻近。
六、应用场景
- 微控制器主时钟源（MCU、DSP）
- 通信与网络设备（时钟参考、PHY 驱动）
- 工业控制与仪表（需要工业温度范围）
- 消费电子与可穿戴设备（小型化、贴片封装）
七、可靠性与注意事项
器件为工业级温度范围，适合要求长期稳定性的产品。选型与量产前建议向供应商索取完整的规格书与可靠性测试报告（温度循环、振动、回流焊合格性等），并进行批量样品测试。焊接与清洗工艺、PCB 板层栈结构均会影响寄生电容与最终频率，设计时预留调试空间以确保成品频率符合系统要求。
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