WMSIC Electronic Components

YXC XL2SI-111-16M Crystal XL2SI

ModelXL2SI-111-16M
PackageSMD3225-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC XL2SI-111-16M
Type
YXC Yangxing Technology
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
XL2SI-111-16M
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.044g
Frequency
16MHz
Electronic Component
1
Electronic Component
BM0226447316
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL2SI-111-16M 产品概述

一、产品简介

XL2SI-111-16M 为贴片式晶体振荡元件,标称频率 16.000MHz,面向对频率精度与稳定性有较高要求的电子设备时钟与振荡应用。该产品采用 SMD3225-4P 封装(3.2 × 2.5 mm 级别),由 YXC 扬兴科技生产,适合表贴组装与自动化贴装流程,兼顾尺寸、可靠性与成本。

二、技术规格要点

  • 标称频率:16.000 MHz
  • 常温频差(25°C):±10 ppm
  • 温度频率稳定度:±20 ppm(工作温度范围内)
  • 工作温度:-40°C ~ +85°C(工业级温区)
  • 负载电容:20 pF
  • 封装类型:SMD3225-4P(贴片晶振)
    这些参数表明该器件在标准工业温度范围内能够提供高精度的基准频率,适用于对时钟精度有严格要求的系统。

三、典型应用场景

  • 微控制器系统时钟(MCU 外部晶振)
  • 无线通讯模块(作为参考时钟来源)
  • 工业控制与自动化设备
  • 嵌入式设备与物联网终端(IoT 节点)
  • 需要尺寸受限且对频率稳定性有要求的消费电子产品

四、封装与焊接建议

  • 封装:SMD3225-4P,适配 3225 标准贴片焊盘布局,便于表面贴装技术(SMT)生产。
  • 焊接建议:遵循常规无铅回流工艺,避免过高峰值温度与超长热暴露时间;焊接前后避免对晶体施加机械应力(弯曲、压迫),以免导致频率漂移或损坏。
  • 布局建议:晶振靠近被驱动器件(如 MCU)放置,走线短且粗,避免高速噪声源干扰;合理配置并匹配负载电容(20 pF)以确保标称频率。

五、可靠性与选型注意事项

  • 温度范围与稳定度:-40~+85°C 与 ±20 ppm 的稳定度适合大多数工业/消费类应用,但对更高精度或更宽温区(如汽车 AEC-Q)需求的场合,应确认对应认证与更严苛参数。
  • 负载电容匹配:实际电路中请根据 PCB 与输入端电容分布调整两端负载电容值,保证振荡点位于标称频率。
  • 机械与应力敏感性:贴片晶体对基板应力敏感,建议在设计 PCB 时避开过度焊盘下挠与固定件压力。
  • 采购与质量控制:建议向官方渠道或授权代理采购,索取检验报告与规格书,确认批次一致性与出厂测试数据。

六、总结

XL2SI-111-16M(16MHz,20pF,常温 ±10ppm,温区 -40~+85°C,封装 SMD3225-4P)为一款面向工业与消费类应用的高稳定性贴片晶振。其小型化封装与良好的温度性能,使其适合在对频率精度与可靠性有要求的嵌入式系统中作为稳健的时钟源。选型时应关注负载电容匹配、焊装工艺及环境应力控制,以确保长期稳定运行。

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