WMSIC Electronic Components

YXC XL2MI-111-25M Crystal XL2MI

ModelXL2MI-111-25M
PackageSMD3225-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC XL2MI-111-25M
Type
YXC Yangxing Technology
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
XL2MI-111-25M
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.04g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0226447326
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
10pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL2MI-111-25M 产品概述

一、产品简介

XL2MI-111-25M 是扬兴科技(YXC)推出的一款高稳定性无源贴片晶振,工作频率为 25.000 MHz,封装为 SMD3225-4P(典型尺寸 3.2 × 2.5 mm)。该器件属于无源晶体谐振器,需要外部振荡电路配合使用,适用于对频率精度和温度稳定性有较高要求的电子系统。典型应用包括微控制器时钟、通信模块、高清音视频同步以及各种工业控制与消费类电子设备。

二、主要参数

  • 品牌:YXC 扬兴科技
  • 型号:XL2MI-111-25M
  • 类型:无源晶振(贴片晶振)
  • 标称频率:25 MHz
  • 常温初始频差(25℃):±10 ppm
  • 温度范围内频率稳定度(-40℃ ~ +85℃):±20 ppm
  • 负载电容:10 pF
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:SMD3225-4P

三、主要特性

  • 高频率精度:25 MHz 基准频率,常温初始频差仅 ±10 ppm,适合需要高精度时钟源的系统。
  • 良好温度稳定性:在宽温区间(-40℃ 至 +85℃)内保持 ±20 ppm 稳定度,适应工业级环境。
  • 紧凑封装:SMD3225 小尺寸节省 PCB 面积,便于自动贴装与批量生产。
  • 无源设计:低功耗系统中可与低功耗振荡器电路配合使用,灵活性高。

四、典型应用

  • 单片机/微处理器系统时钟源
  • 无线通信模块(Wi‑Fi、Bluetooth 等)参考频率
  • 数据采集与传感器同步电路
  • 工业控制、测量仪器及医疗设备(在其温度范围内)
  • 音视频设备与数位接口的时钟同步

五、选型与使用建议

  • 匹配负载电容:器件标称负载电容为 10 pF,设计时应按振荡器芯片数据手册计算并配置合适的并联/等效电容值,以保证振荡频率与启动性能。
  • 振荡器电路选择:作为无源晶振,需配合厂家推荐的两晶体管或 CMOS 晶体振荡器(Colpitts、Pierce 等)使用,注意避免过驱动导致晶片老化。
  • 布局注意事项:晶体应尽量靠近振荡器输入引脚放置,两端引线尽可能短且对称,避免信号线和有源器件互相干扰;在晶振附近保持良好接地,避免地线回流对频率造成影响。
  • 焊接工艺:采用回流焊贴装,建议遵循厂商提供的回流曲线与抗热可靠性规范,避免超温或多次高温循环以防性能退化。
  • ESD 与过压防护:在设计中考虑适当的防静电与谐振器输入保护措施,尤其在易受静电或浪涌干扰的应用场景。

六、封装与可靠性、采购建议

SMD3225-4P 封装便于贴片生产与自动化装配,适合中高密度 PCB 设计。XL2MI-111-25M 在 -40℃ 至 +85℃ 工作范围内通过常规可靠性测试,满足工业级使用需求。量产选型时建议向扬兴科技或其授权代理索取完整规格书(Datasheet)、可靠性报告及回流焊工艺建议,以便在具体项目中进行验证与长期寿命评估。若有更严格的环境或频率稳定性要求,可与厂商沟通定制或选择更高等级产品。

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