WMSIC Electronic Components

YXC X322512MLB4SI Crystal X322512MLB4SI

ModelX322512MLB4SI
PackageSMD3225-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
YXC X322512MLB4SI
Type
YXC Yangxing Technology
Minimum package
3000

Technical parameters

Electronic Component
YXC
Electronic Component
X322512MLB4SI
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.047g
Frequency
12MHz
Electronic Component
1
Electronic Component
BM0225319425
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
9pF
Frequency
±20ppm
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X322512MLB4SI 无源晶振产品概述

概要

X322512MLB4SI 是由扬兴科技(YXC)生产的高性能无源晶振,专为各种电子设备提供精确的时钟信号。以下是对此产品的详细介绍。

基础参数

  • 商品分类: 无源晶振
  • 工作温度: -40℃ ~ +85℃
  • 常温频差: ±10 ppm
  • 晶振类型: 贴片晶振
  • 负载电容: 9 pF
  • 频率: 12 MHz
  • 频率稳定度(全温): ±20 ppm

描述

X322512MLB4SI 是一种贴片式无源晶振,采用SMD3225-4P封装。这种封装形式使其适合于现代电子设备中的Surface Mount Technology(SMT)生产过程,提高了生产效率和可靠性。

特点

高频率精度

X322512MLB4SI 提供了极高的频率精度,在常温条件下,频差仅为 ±10 ppm。在整个工作温度范围内,频率稳定度保持在 ±20 ppm,这使得它特别适用于需要高时钟精度的应用,如通信设备、计算机系统和工业控制系统。

宽温工作范围

该晶振能够在 -40℃ ~ +85℃ 的广泛温度范围内稳定工作,这使得它可以应用于各种环境条件下的设备,从极寒的工业场所到高温的户外环境。

低负载电容

X322512MLB4SI 的负载电容为 9 pF,这是一个相对较低的值,能够减少对外围电路的负担,并且有助于简化设计过程。

小尺寸封装

采用 SMD3225-4P 封装,X322512MLB4SI 具有紧凑的体积,非常适合于现代电子产品的miniaturization趋势。这种小尺寸设计不仅节省了空间,还提高了设备的整体可靠性和耐用性。

应用场景

通信设备

在无线通信设备、基站设备和网络设备中,高精度的时钟信号是至关重要的。X322512MLB4SI 因其高频率精度和稳定性,成为这些应用中的理想选择。

计算机系统

计算机主板、服务器和数据中心设备需要高可靠性的时钟源。X322512MLB4SI 的广温工作范围和高频率稳定度,使其成为这些系统中的优选元件。

工业控制系统

工业控制系统,例如PLC(可编程逻辑控制器)和机器人控制系统,要求元件在恶劣环境下保持稳定运行。X322512MLB4SI 的宽温工作范围和高耐用性,使其特别适用于这些应用。

消费电子产品

在智能家居设备、智能穿戴设备以及其他消费电子产品中,紧凑且高精度的时钟源是必不可少的。X322512MLB4SI 的小尺寸设计和高性能特性,使其成为这些产品的理想选择。

使用注意事项

  • 安装: 请确保在SMT生产过程中按照推荐的焊接参数进行安装,以避免因过热而导致晶振损坏。
  • 电路设计: 在设计外围电路时,应考虑到负载电容(9 pF)以确保最佳性能。
  • 环境保护: 避免将晶振暴露在过高湿度或腐蚀性环境中,以延长其使用寿命。

总结

X322512MLB4SI 无源晶振通过其高频率精度、宽温工作范围和紧凑的设计,成为现代电子设备中不可或缺的一部分。无论是在通信设备、计算机系统还是工业控制系统中,它都能提供可靠且高性能的时钟信号,满足不同应用场景下的需求。通过选择X322512MLB4SI,无疑会为您的产品带来更高的可靠性和性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.