WMSIC Electronic Components

YXC OT20168MJBA4SL Oscillator OT20168MJBA4SL

ModelOT20168MJBA4SL
PackageSMD2016-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC OT20168MJBA4SL
Type
YXC Yangxing Technology
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
OT20168MJBA4SL
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.02g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0257262928
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.3V
Electronic Component
±10ppm
Output
CMOS
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

OT20168MJBA4SL 产品概述

一、产品简介

OT20168MJBA4SL 是扬兴科技(YXC)生产的一款表面贴装微型晶振,标称频率 8.000MHz,常温频差 ±10ppm,输出为 CMOS 电平,工作电压范围宽,适配 1.8V 至 3.3V 的系统电源。封装为 SMD2016-4P,尺寸小、厚度薄,适合对体积与功耗有严格要求的便携与嵌入式应用场景。该器件系列在工业温度范围内工作可靠,对中低速 MCU、通信、传感与时钟同步电路具有良好适配性。

二、主要规格

  • 型号:OT20168MJBA4SL(系列参考标识 YSO110TR)
  • 频率:8.000 MHz
  • 常温频差:±10 ppm(出厂校准)
  • 频率稳定度:±20 ppm(典型器件在温度与老化影响下的推荐评估,详细指标请参见数据手册)
  • 输出模式:CMOS
  • 工作电压:1.8 V ~ 3.3 V
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:SMD2016-4P(标准贴片封装,便于自动贴装与回流焊)

三、性能特点

  • 高频率精度高:常温 ±10ppm 的出厂精度保证了系统时钟基准的稳定性,适合对时间基准要求较高的控制与通信应用。
  • 宽电压兼容:1.8V 到 3.3V 的供电范围可直接匹配多种低功耗 MCUs 与逻辑电平,减少外部电源适配设计。
  • 工业级温度范围:-40℃ 至 +85℃ 满足绝大多数工业和户外环境的稳定性需求。
  • 小型 SMD 封装:SMD2016-4P 提供小占板面积,利于高密度 PCB 布局与批量加工。
  • CMOS 输出:直接驱动数字输入,不需外接耦合电容,简化外围电路设计。

四、典型应用

  • MCU 时钟源(8MHz 系统、低速总线)
  • 工业控制与数据采集设备的时间基准
  • 通讯模块与射频前端的本振参考(非高精度 RF)
  • 可穿戴、消费电子与低功耗传感器节点
  • RTC 辅助参考与频率合成的参考输入

五、封装与安装建议

  • 封装:SMD2016-4P,建议按制造商推荐的焊盘尺寸设计 PCB,以保证焊接可靠性与热循环耐受性。
  • 焊接:支持回流焊工艺,建议按晶振厂商回流曲线进行,避免过高峰值温度或过长保温时间。
  • 布局:晶振周边应保持适度的地平面并远离高频开关电源和大电流回路,减少电磁干扰对频率稳定性的影响。
  • 去耦:供电端应在近端放置适当的旁路电容以滤除电源噪声,提升输出抖动性能。

六、选型与使用注意

  • 频率稳定度声明为 ±20ppm,若系统对温漂或长期老化有更严格要求,请联系供应商索取完整的温度特性与老化曲线或选用更高精度型号。
  • CMOS 输出适合直接驱动逻辑输入,但若需与高阻抗或特殊负载接口匹配,请参考器件电气特性表确认输出电流能力与上拉/下拉要求。
  • 对于关键时序电路,建议在样片阶段验证启动时间、相位噪声与抖动,以确保满足系统整体时序裕度。

七、可靠性与包装

  • 扬兴科技提供量产测试与可靠性验证,器件适配自动贴片生产与回流焊流程。
  • 包装形式与出货批次、存储及防潮要求请参见出厂包装说明,建议在规定的回流前保质期内贴装并按湿敏等级(MSL)流程处理。

如需更详细的电气参数、波形、典型应用电路或样品支持,可联系供应商技术支持索取 OT20168MJBA4SL 的完整数据手册与评估板资料。

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