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YXC X161232MKB4SI Crystal X161232MKB4SI
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YXC X161232MKB4SI
- Type
- YXC Yangxing Technology
- Minimum package
- 3000
Technical parameters
- Electronic Component
- YXC
- Electronic Component
- X161232MKB4SI
- Electronic Component
- 1
- Package
- SMD1612-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.023g
- Frequency
- 32MHz
- Electronic Component
- 1
- Electronic Component
- BM0230024950
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 8pF
- Frequency
- ±30ppm
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X161232MKB4SI 产品概述
一、产品简介
X161232MKB4SI 为贴片无源晶振，型号对应 YSX1612SL 系列，品牌为 YXC 扬兴科技。该器件采用 SMD1612-4P 小型封装（1.6 × 1.2 mm），提供 32.000 MHz 基准频率，适用于对体积和频率精度有较高要求的嵌入式与通信类设备。
二、主要性能参数
- 晶振类型：贴片无源晶振（SMD，需外部振荡器电路）
- 标称频率：32.000 MHz
- 常温频差（25℃）：±10 ppm
- 负载电容：8 pF
- 频率稳定度（温度相关）：±30 ppm（工作温度范围内）
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装：SMD1612-4P（低体积、适合高密度贴装）
三、产品特点
- 小型化封装，节省 PCB 面积，利于产品微型化设计。
- ±10 ppm 的常温频差提供良好初始精度，配合合理电路可满足多数时钟/定时需求。
- 8 pF 的负载电容针对高频应用优化，便于在现代 MCU、FPGA 和无线收发模块中实现稳定振荡。
- 宽温工作范围和 ±30 ppm 的温度稳定度，适应工业级环境与一般消费类电子使用场景。
四、典型应用场景
- MCU/MPU 系统时钟与参考频率源（需外部振荡器电路）
- 无线通信模块、射频前端参考钟（非直接用于高精度 RF 合成器时需评估相位噪声）
- 消费电子、车载电子（非严苛汽车级）、工业控制以及计时、同步电路等领域。
五、可靠性与封装信息
SMD1612-4P 封装适合标准 SMT 流程，建议按制造商数据手册执行焊接温度曲线与储存条件。器件为无源晶体单元，对机械冲击、过度弯曲和焊接热应力敏感，贴装与回流焊工艺需严格控制以保证长期稳定性与一致性。
六、选型与注意事项
- 该器件为无源晶振，使用时需搭配合适的放大器/驱动电路（如微控制器内部振荡器或外置晶体振荡器电路）。
- 评估系统总体频率容差、相位噪声与抖动需求，若系统对相位噪声要求严格，建议参考供应商完整规格书或选用有源晶振/OCXO。
- 采购时确认批次与出货规格，必要时要求样品进行实际电路验证和环境应力测试。
如需器件数据表、封装尺寸图或样品测试报告，可提供后续支持与采购建议。
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