Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X322513MSB4SI 是由扬兴科技(YXC)生产的高性能无源晶振,专为各种电子设备提供精确和稳定的时钟信号。以下是对此产品的详细介绍。
X322513MSB4SI 无源晶振具有极高的频率精度,常温频差仅为 ±10 ppm,整个工作温度范围内的频率稳定度为 ±20 ppm。这使得它特别适合要求高时钟精度的应用场景,如通信设备、计算机系统、工业控制设备等。
该晶振支持在 -40℃ ~ +85℃ 的广泛温度范围内工作,这使得它能够在各种环境条件下保持稳定运行。这种特性使其成为极端环境下的理想选择,例如汽车电子、工业自动化和军事设备。
#####贴片封装 X322513MSB4SI 采用 SMD3225-4P 封装形式,适合自动化Surface Mount Technology(SMT)生产流程。这种封装方式不仅提高了生产效率,还减小了设备尺寸,满足现代电子产品对miniaturization的需求。
该晶振的负载电容为 20 pF,这是一个相对较低的值。低负载电容可以简化外围电路的设计,并减少因电容匹配不良而引起的频率漂移问题。
在通信设备中,稳定的时钟信号对于确保数据传输的准确性和可靠性至关重要。X322513MSB4SI 的高频率精度和稳定性使其成为基站、无线路由器、调制解调器等通信设备的理想选择。
计算机系统中的时钟信号直接影响到处理器的性能和数据处理速度。使用 X322513MSB4SI 可以确保计算机系统在各种温度条件下保持高效运行。
工业控制设备通常需要在恶劣环境下运行,例如高温、低温或振动条件。X322513MSB4SI 的宽温工作范围和高频率稳定度使其成为工业控制系统中的优选元件。
汽车电子系统对元器件的耐用性和稳定性有非常高的要求。由于其广泛的工作温度范围和高频率精度,X322513MSB4SI 适用于各种汽车电子应用,如导航系统、娱乐系统和安全控制系统。
在 PCB 设计中,需要确保晶振周围区域尽可能减少噪声干扰。建议在布局时将晶振放在较为静止的区域,并使用地线层来屏蔽干扰。
外围电路的设计应根据具体应用需求进行优化。一般来说,需要连接适当的负载电容(本例中为 20 pF)以确保晶振的正常工作。
在集成和测试过程中,建议使用专业仪器对晶振的频率精度进行验证,以确保其符合预期性能。
X322513MSB4SI 无源晶振是扬兴科技生产的一款高性能产品,通过其卓越的频率精度、宽温工作范围和贴片封装形式,满足了现代电子设备对时钟信号稳定性的严格要求。无论是在通信设备、计算机系统、工业控制还是汽车电子领域,X322513MSB4SI 都是您的理想选择。通过合理的设计与集成,可以充分发挥出此产品的优势,为您的应用提供可靠和高效的时钟信号解决方案。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products