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YXC X201616MOB4SI Crystal X201616MOB4SI
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YXC X201616MOB4SI
- Type
- YXC Yangxing Technology
- Minimum package
- 3000
Technical parameters
- Electronic Component
- YXC
- Electronic Component
- X201616MOB4SI
- Electronic Component
- 1
- Package
- SMD2016-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.002g
- Frequency
- 16MHz
- Electronic Component
- 1
- Electronic Component
- BM0264933800
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12pF
- Frequency
- ±20ppm
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X201616MOB4SI 产品概述 — YXC扬兴科技 16MHz 无源贴片晶振
一、产品简介
X201616MOB4SI 是 YXC（扬兴科技）推出的一款高可靠性无源贴片晶振，工作频率为 16MHz，采用 SMD2016-4P 封装（小型化 2.0×1.6mm 级别封装），适用于空间受限的消费类与工业电子设备。该器件为无源晶体元件，需要配合振荡电路或 MCU 内置振荡器驱动使用。
二、主要参数
- 晶振类型：无源贴片晶振（SMD）
- 标称频率：16.000 MHz
- 常温频差：±10 ppm
- 负载电容：12 pF
- 频率稳定度：±20 ppm
- 工作温度范围：-40 ℃ ～ +85 ℃
- 封装型号：SMD2016-4P
- 品牌：YXC 扬兴科技
三、主要特性
- 精度高：常温频差仅 ±10 ppm，满足对时钟精度要求较高的微控制器和通信模块。
- 温度适应宽：-40～+85℃ 的工业级工作温度，适合大多数嵌入式与便携式应用。
- 小型化封装：SMD2016 小尺寸，利于高密度 PCB 布局与自动贴装生产。
- 负载电容匹配：标配 12 pF，便于与常见 MCU/振荡器电路匹配，减少外部调试工作量。
四、典型应用
- 单片机（MCU）主时钟源与外部晶体振荡输入
- 无线通信模块、蓝牙、Wi‑Fi 子板定时
- 时钟、电表、测量仪器与传感器节点
- 消费电子、工业控制与物联网终端
五、封装与焊接建议
- 建议采用与 SMD2016 相配套的 PCB 焊盘布局，保证良好焊接强度与热回流兼容性。
- 在布板时注意晶体周围应避免大面积铜箔与强噪声信号线，以减少寄生电容与耦合干扰。
- 对于无源晶振，推荐在晶体两端至地的旁路/耦合电容按目标芯片参考设计选型并调试，确保振荡启动与相位稳定性。
- 储存与贴装过程中避免受潮、受压与强振动，遵循常规 SMD 元件防静电与防污染处理规范。
六、选型与采购提示
- 选型时确认目标电路的负载电容与驱动能力是否与 12 pF 匹配，必要时在两端添加微调元件以优化振荡性能。
- 如需批量供货与可靠性测试报告，请与 YXC 扬兴科技或其授权代理联系，获取最新的出货规格书与质量认证资料。
X201616MOB4SI 以其小巧外形与稳定频率特性，适合追求高密度布板与长期稳定运行的电子产品，能够为系统提供可靠的时钟参考。
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