WMSIC Electronic Components

YXC X201625MOB4SI Crystal X201625MOB4SI

ModelX201625MOB4SI
PackageSMD2016-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC X201625MOB4SI
Type
YXC Yangxing Technology
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
X201625MOB4SI
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.03g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0228548958
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X201625MOB4SI 产品概述

一、产品简介

X201625MOB4SI 是 YXC(扬兴科技)推出的一款无源贴片晶振,封装为 SMD2016-4P(约 2.0 × 1.6 mm 四焊盘)。标称频率 25.000 MHz,属于常用的参考时钟源,适用于对频率精度和稳定性有较高要求的嵌入式、通信及网络设备。工作温度范围为 -40 ℃ 至 +85 ℃,适合工业级应用。

二、主要技术参数

  • 晶振类型:无源贴片晶振(SMD)
  • 频率:25.000 MHz
  • 常温频差(Initial Tolerance):±10 ppm
  • 频率稳定度(Total Stability,含温度、老化等):±20 ppm
  • 负载电容(CL):12 pF
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD2016-4P
  • 品牌:YXC 扬兴科技

三、产品特点

  • 小型封装,适合集成度高的 PCB 布局。
  • 常温频差 ±10 ppm,保证上电初始频率精度。
  • 总体频率稳定度 ±20 ppm,符合多数通信、测量及控制类系统的长期稳定性需求。
  • 宽温工作范围满足工业级环境要求。
  • 无源设计,兼容主流 MCU/PLL 的外部晶体输入。

四、典型应用场景

  • 嵌入式微控制器和 DSP 时钟源。
  • 通信模块与网络设备(参考时钟、PLL 参考)。
  • 测试测量仪器与计时设备。
  • 低功耗物联网终端与消费电子产品。
  • 其他需 25 MHz 基准的系统设计。

五、使用与焊接建议

  • 负载电容:推荐在晶体两端各并联外接电容,若电路板及引脚寄生电容约 2–3 pF,则每侧电容可选 ~18–20 pF(按 C = 2×(CL - Cstray) 估算),最终以系统实际频率校准为准。
  • 布局:晶振与 MCU/PLL 引脚距离应尽量短,走线尽量对称且避免经由地平面分割处。建议在晶振周围留出地平面并做良好接地以降低噪声影响。
  • 焊接:遵循厂家无铅回流焊工艺,避免超过推荐峰值温度并控制高温停留时间。焊接和除焊操作应避免强振动和机械冲击。
  • 驱动功率:为保证长期可靠性和频率稳定性,应保持较低驱动功率,具体最大驱动等级请参见厂家数据手册。
  • 储存与处理:避免潮湿、高温及强烈机械应力;建议按厂家推荐条件进行干灯保存和回流前干燥处理(如适用)。

六、封装与采购信息

  • 型号:X201625MOB4SI
  • 封装:SMD2016-4P(贴片,四焊盘)
  • 品牌:YXC 扬兴科技
  • 包装方式:常见为卷带(Tape & Reel),大批量采购可与供应商确认交付方式。
  • 选型建议:在量产前建议索取样片并在目标电路上验证初始频差、温漂及老化特性,必要时与扬兴科技技术支持沟通以获取完整数据手册与可靠性报告。

以上为 X201625MOB4SI 的核心概述与工程应用建议,具体电气与机械细节请以厂家 Datasheet 为准。

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