WMSIC Electronic Components

YXC X503230MSB2GI Crystal X503230MSB2GI

ModelX503230MSB2GI
PackageSMD5032-2P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC X503230MSB2GI
Type
YXC Yangxing Technology
Minimum package
1000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
X503230MSB2GI
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.153g
Frequency
30MHz
Electronic Component
1
Electronic Component
BM0229913908
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X503230MSB2GI 产品概述

一、产品简介

X503230MSB2GI 为 YXC(扬兴科技)出品的无源贴片晶振,基频 30.000 MHz,采用 SMD5032-2P 封装(典型尺寸 5.0 × 3.2 mm、两端电极)。该器件为无源晶体需配合外部振荡器电路(如常用 Pierce 或 Colpitts 架构)使用,适合对频率精度与温度稳定性有中高要求的电子设备。

二、主要参数

  • 标称频率:30 MHz
  • 常温频差(室温):±10 ppm
  • 频率稳定度(-40℃ ~ +85℃):±30 ppm
  • 负载电容:20 pF
  • 工作温度范围:-40℃ ~ +85℃
  • 封装:SMD5032-2P(贴片)
  • 类型:无源晶振

三、产品特性

  • 高频率、噪声低,适合通信、时钟源等应用场景;
  • 紧凑封装,便于表面贴装与自动化生产;
  • 宽温工作范围与较好温度稳定性,适用于工业级应用;
  • 指定 20 pF 负载,便于与常见 MCU/PLL 前端匹配。

四、应用场景

  • 无线通信设备(如 RF 前端、射频合成);
  • 时钟发生器、定时与同步电路;
  • 工业控制、测试仪器、测量设备;
  • 消费类电子需高稳定时钟的场合。

五、使用建议与注意事项

  • 负载电容匹配:若 PCB 杂散电容约 2~5 pF,建议两侧串联电容 C1 = C2 ≈ 2×(CL − Cstray),实务上常选 33 pF 作为起点,需在目标电路中调校以获得最佳频点与启动特性。
  • 振荡器拓扑:推荐使用 Pierce 架构,注意晶体的驱动电平与电阻限制以防失真或过驱动。具体 ESR、驱动电平与启动时间请参考扬兴科技详细数据表。
  • 焊接工艺:遵循无铅回流规范,建议最大回流峰值温度不超过 260℃,在实际工艺参数上以供应商推荐为准;避免反复热循环与强机械应力。
  • 存储与搬运:避免潮湿、高温与强振动;若包装为吸湿贴装箱,请按供应商建议进行预烘以防湿气。

六、封装与订购信息

  • 封装型号:SMD5032-2P;品牌:YXC 扬兴科技;型号:X503230MSB2GI。
  • 型号拆解参考(一般命名规则):X5032 表示 5.0×3.2mm 封装;30 表示 30MHz;MSB2 代表系列及负载 20pF;GI 可能表示无铅/RoHS 版本。具体含义请以厂方数据表与订单说明为准。

如需进一步的电气特性曲线(ESR、等效电路参数、启动时间、老化特性)或完整的封装机械图与回流建议,请提供联系信息或向扬兴科技索取该型号完整数据表。

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