Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YXC X201632MMB4SI Crystal X201632MMB4SI
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- YXC X201632MMB4SI
- Type
- YXC Yangxing Technology
- Minimum package
- 3000
Technical parameters
- Electronic Component
- YXC
- Electronic Component
- X201632MMB4SI
- Electronic Component
- 1
- Package
- SMD2016-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.035g
- Frequency
- 32MHz
- Electronic Component
- 1
- Electronic Component
- BM0228538334
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 10pF
- Frequency
- ±20ppm
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X201632MMB4SI 产品概述
一、产品简介
X201632MMB4SI 是扬兴科技（YXC）推出的一款贴片无源晶振，标称频率 32.000 MHz，面向对时钟精度和体积有较高要求的嵌入式与通信类应用。器件采用 SMD2016-4P 小封装设计，常温频差 ±10 ppm，规格频率稳定度 ±20 ppm，负载电容 10 pF，适用温度范围 -40℃ 到 +85℃，满足工业级环境使用需求。
二、主要特性
- 频率：32.000 MHz（无源晶体，需要配合外部振荡电路工作）
- 常温频差：±10 ppm（出厂校准，适用于要求较高的基准时钟）
- 负载电容：10 pF（请在设计时与外围晶振电容匹配以获得最佳振荡性能）
- 频率稳定度：±20 ppm（含温度影响下的典型稳定水平）
- 工作温度：-40℃ ~ +85℃（工业级温度范围）
- 封装：SMD2016-4P（小型贴片，适合高密度 PCB 布局）
- 类型：无源晶振（无源器件、低功耗、长期稳定）
三、典型应用
- 微控制器（MCU）与系统时钟源
- 通信模块与射频前端的本振参考
- 定时/计数、数据采集与测控系统
- 工业自动化、物联网终端与便携设备中对体积与稳定性有要求的场景
四、封装与机械信息
SMD2016-4P 为行业常用微小贴片封装，外形尺寸约为 2.0 × 1.6 mm，四端子结构便于焊接和定位。小尺寸有利于高密度布板和对称布局，推荐将晶振靠近振荡器管脚布局并保证良好接地以降低干扰。
五、使用建议与注意事项
- 作为无源晶振，必须与对应的振荡器电路（反相器/晶振驱动）及配套负载电容配合才能稳定振荡。
- 负载电容应根据电路与 PCB 寄生电容适当调整，通常以 10 pF 为目标值。
- 布局时应尽量缩短晶振与驱动器之间的连线，并在地平面上做好隔离与屏蔽以减小噪声耦合。
- 焊接与贴装时请遵循厂家推荐的回流工艺与湿存放规范，避免机械应力或过度振动导致频率漂移或损伤。
- 推荐在采购或设计前索取完整器件 datasheet，确认回流温度曲线、包装形式（卷带/托盘）与可靠性测试数据。
六、采购与技术支持
产品型号：X201632MMB4SI，品牌：YXC 扬兴科技。若需样品、批量报价或详细规格书（含频率-温度曲线、老化数据与等效电路参数），建议联系扬兴科技授权经销商或厂方技术支持，以获得针对应用的选型建议和质量保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
