WMSIC Electronic Components

YXC OT201624MJBA4SL Oscillator OT201624MJBA4SL

ModelOT201624MJBA4SL
PackageSMD2016-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
YXC OT201624MJBA4SL
Type
YXC Yangxing Technology
Minimum package
3000

Technical parameters

Electronic Component
YXC
Electronic Component
OT201624MJBA4SL
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.019g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0228574650
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.3V
Electronic Component
±10ppm
Output
CMOS
Frequency
±20ppm
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

OT201624MJBA4SL 产品概述

一、产品简介

OT201624MJBA4SL 是 YXC(扬兴科技)推出的一款有源晶振,额定频率 24.000MHz,常温频差 ±10ppm,输出为 CMOS 电平,供电电压范围 1.8V 至 3.3V,整机频率稳定度标称 ±20ppm,工作温度范围 -40℃ 至 +85℃,封装为 SMD2016-4P。该器件集成振荡电路,使用方便,适用于需高精度时钟源的小型化电子产品。

二、主要特性

  • 频率:24.000MHz,常温频差 ±10ppm,适合对频率精度有较高要求的系统。
  • 输出模式:CMOS,兼容多数数字逻辑电平,驱动能力良好,输出波形方正。
  • 供电范围:1.8V~3.3V,覆盖主流单片机、通信芯片与低功耗系统电压。
  • 稳定度:频率稳定度 ±20ppm(器件规格标注),满足工业级温度范围内的时钟需求。
  • 工作温度:-40℃~+85℃,适合工业级应用场景。
  • 封装:SMD2016-4P,体积小、便于贴片工艺和高密度布局。

三、典型应用

  • 单片机(MCU)系统的主/从时钟源
  • 通信设备与无线模组的本振或参考时钟
  • 工业控制、仪器仪表中的高精度定时电路
  • 音视频同步、数据采集系统、低功耗终端等需稳定时钟的场合

四、布局与使用建议

  • 电源去耦:建议 VCC 侧靠近引脚并放置 0.01µF~0.1µF 的陶瓷去耦电容,以抑制电源噪声对振荡稳定性的影响。
  • 接地处理:器件底部及附近保持良好接地,减小地回路阻抗。
  • 信号完整性:CMOS 输出对负载敏感,必要时在输出端并联适当阻尼(如串联小阻)以减少反射和振铃,尤其在长线或高频 PCB 路径上。
  • 温度与机械:避免靠近大功率器件和热源,贴片焊接工艺应遵循厂家回流曲线以保证可靠性。

五、选型与注意事项

  • 若系统对相位噪声或超低抖动有严格要求,应咨询厂家获取更详细的相位噪声/抖动数据或选择专用低相噪晶振。
  • 频率稳定度规格(±20ppm)应结合工作温度范围、长期老化等因素评估整体时钟误差预算。
  • 确认封装(SMD2016-4P)和焊盘尺寸与 PCB 布局一致,避免贴装缺陷。

六、可靠性与包装

OT201624MJBA4SL 适用于工业温度等级,其小型化封装便于自动贴片与高密度组装。常见包装形式为托盘或卷带,可按需向供应商确认最小订购量、供货周期及出货检验资料(如频率测试报告、出厂检定证书等)。

如需更详细的电气参数(如输出电平、高低电平阈值、输出阻抗、启动时间及相位噪声),建议向 YXC 扬兴科技索取完整数据手册与样片验证,以便在目标应用中完成可靠性与性能验证。

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