Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
OT2JI-111-10M 是 YXC 扬兴科技推出的一款高可靠性 10.000 MHz 晶体振荡器,针对工业级和消费级电子设备的系统时钟需求而设计。器件采用 SMD3225-4P 小型封装,输出为 CMOS 电平,工作电压范围宽(1.8V–3.3V),在-40℃ 至 +85℃ 的工作温度范围内仍能保持优良的频率稳定性与温度特性。常温频差典型值为 ±10 ppm,频率稳定度(含温漂等)可达到 ±20 ppm,适合对频率精度有较高要求的应用场景。
(注:详细的电气参数、波形图与老化测试数据请参阅原厂数据手册或联系技术支持索取完整文档。)
OT2JI-111-10M 采用 SMD3225-4P 表面贴装封装,典型尺寸 3.2 × 2.5 mm,四引脚布局便于自动贴装与回流焊接。该小型化封装有利于高密度电路板布局,适合移动设备、模块化设计与空间受限的工控板卡。封装引脚排列和焊盘推荐尺寸请依照厂家推荐的 PCB 布局尺寸执行。
产品型号:OT2JI-111-10M
品牌:YXC 扬兴科技
封装:SMD3225-4P
如需批量采购、样品、定制频差/稳定度等级或接收完整技术手册与管脚图,请联系供应商或 YXC 扬兴科技授权经销商。技术支持可提供匹配电路建议、PCB 焊盘布局参考以及可靠性测试数据,帮助客户快速完成产品验证与量产导入。
如需我方为特定应用提供电路匹配建议或替代型号对比,请告知目标系统的电源、电平与负载要求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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