Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YXC XC322530MOB4SA-18 Crystal XC322530MOB4SA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC XC322530MOB4SA-18
- Type
- SMD3225-4P
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- XC322530MOB4SA-18
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.08g
- Frequency
- 30MHz
- Electronic Component
- 1
- Electronic Component
- BM0230878016
- Operating Temperature
- 40℃~+125℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12pF
- Frequency
- ±80ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XC322530MOB4SA-18 产品概述
一、概述
XC322530MOB4SA-18 为 YXC（扬兴科技）出品的高可靠性贴片晶体/晶振元件，额定频率 30.000 MHz，封装为 SMD3225-4P。器件针对工业级及车规级工作环境设计，工作温度范围宽 (-40℃ ~ +125℃)，常温频差（Initial accuracy）典型 ±10 ppm，整温带频率稳定度可达 ±80 ppm，适合对频率精度和温度稳定性有较高要求的时钟源应用。
二、主要特性
- 频率：30.000 MHz；常温频差 ±10 ppm；整温频率稳定度 ±80 ppm
- 负载电容：12 pF（器件标称值，最终频率依所用负载电容与电路杂散电容而定）
- 封装：SMD3225-4P（3.2 × 2.5 mm 体积小，四端结构便于贴装与屏蔽）
- 工作温度：-40℃ ~ +125℃，适用于工业、车载及通信类环境
- 品牌：YXC 扬兴科技，良好供应链与生产一致性
三、电气与频率注意事项
- 负载电容对频率有直接影响，电路中并联的两侧负载电容与 PCB 板间寄生电容之和需使晶体实际感受的等效负载接近 12 pF，以保证标称频率精度。
- 建议在调试阶段通过替换负载电容来微调实际频率；常见起始值范围为 12–22 pF，具体取值以板上寄生电容为准。
- 器件驱动电平需控制在晶体允许范围内（参见厂方数据手册），过高驱动电平可能造成非线性振荡与寿命下降。
四、机械与封装要求
- SMD3225-4P 小型四端结构利于 SMT 工艺贴装；贴装时应避免在器件基座产生过大的机械应力（弯曲、挤压），以免引起振荡频率漂移或损坏。
- 焊接推荐采用回流焊工艺，并遵循厂方的焊接曲线建议；若使用手工焊点，需防止局部过热。
五、应用场景
适用于微控制器与 DSP 时钟、通讯模块（无线、以太网等）、工业控制设备、精密测试仪器以及对温度范围和稳定性有严格要求的嵌入式系统。
六、选型与使用建议
- 评估系统所需的频率稳定度与老化特性，若系统对长期漂移有更高要求，可与供应商确认老化指标与筛选等级。
- 布局上将晶体远离高电流回路与高速信号走线，地线扎实并尽量缩短信号回路长度，以提高抗干扰能力与振荡可靠性。
- 在样机验证阶段测量整机温度特性与频率漂移，必要时通过外部补偿或选择更高等级元件满足系统需求。
如需完整电气参数表、封装图纸、回流焊工艺曲线或等效电路模型，可联系供应商获取 YXC 扬兴科技的详细数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
