WMSIC Electronic Components

YXC XL2OI-111-19.2M Crystal XL2OI

ModelXL2OI-111-19.2M
PackageSMD3225-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC XL2OI-111-19.2M
Type
YXC Yangxing Technology
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
XL2OI-111-19.2M
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
1g
Frequency
19.2MHz
Electronic Component
1
Electronic Component
BM0230025023
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL2OI-111-19.2M 产品概述

一、产品简介

XL2OI-111-19.2M 是扬兴科技(YXC)出品的一款高精度贴片晶振,封装为 SMD3225-4P,标称频率 19.2 MHz。该器件在常温下的初始频差为 ±10 ppm,整体频率稳定度可达 ±20 ppm,负载电容为 12 pF,工作温度范围 -40 ℃ 至 +85 ℃。该产品以体积小、频率稳定、易于贴装为特点,适合对时钟精度和体积有要求的工业与通信类电子设备。

二、主要技术参数

  • 类型:贴片晶振(晶体谐振器,SMD)
  • 型号:XL2OI-111-19.2M
  • 品牌:YXC 扬兴科技
  • 频率:19.2 MHz
  • 常温频差(初始频差):±10 ppm
  • 频率稳定度(温漂+其他因素):±20 ppm
  • 负载电容:12 pF
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD3225-4P(3.2 × 2.5 mm,4 引脚)

三、产品特性与优势

  • 精度高:常温初始频差仅 ±10 ppm,可满足对频率精度要求较高的系统时钟需求。
  • 温度适应性强:在工业级工作温度范围内仍能保持 ±20 ppm 的频率稳定度,适用于工业控制、通信设备等多种环境。
  • 表面贴装封装:SMD3225-4P 适合自动化贴片和回流焊工艺,便于量产与高密度 PCB 设计。
  • 标准化参数:12 pF 负载容值便于与常见的 CMOS/TTL 振荡器电路、微控制器外部晶体输入端匹配。

四、典型应用场景

  • 工业控制与自动化设备:PLC、传感器采集模块等需要稳定时钟源的系统。
  • 通信设备与网通设备:基站收发、时钟同步模块、某些射频前端的本振参考(需结合系统设计)。
  • 嵌入式系统与单片机平台:为 MCU、DSP、FPGA 提供稳定主时钟或参考时钟。
  • 测试与测量仪器、音频/视频处理电路:对采样与同步频率有确定性要求的场景。

五、设计与使用建议

  • 晶体是被动元件,一般需与外围振荡电路(如微控制器内部振荡器或专用晶体振荡器 IC)配合使用;请参考所用 MCUs/OSC IC 厂商推荐的晶体参数与电路拓扑。
  • 负载电容计算:若使用对称的两个寄生电容 C1、C2,理论 CL = (C1×C2)/(C1+C2) + Cstray。对称 C = 2×(CL - Cstray)。以 CL = 12 pF、Cstray 约 2–3 pF 为例,可选择约 18–20 pF 的两只电容;实际可根据 PCB 寄生电容与目标频点微调,推荐在样机上调校确认。
  • PCB 布局:将晶振尽量靠近振荡器输入端布局,走线短且对称,避免大功率回流线或高频信号走线穿插,以减少干扰与寄生电容变化。
  • 焊接与回流:推荐按照 JEDEC/IPC 回流温度曲线进行回流焊,避免超温或过度焊接时间。回流后建议进行功能测试以确认频率偏移在允许范围内。
  • 防护与处理:避免强烈机械应力与挤压,焊接后避免超声波清洗或强酸碱清洗;搬运时注意 ESD 防护,晶体对静电敏感,推荐佩戴防静电手环并使用防静电包装。

六、选型注意事项

  • 若系统要求更宽温域或更高可靠性(如汽车级 -40~+125 ℃),请选用相应温度等级与认证的产品。
  • 若需更高频率精度或更低相位噪声,可考虑更高等级频差或专用 OCXO/TCXO 方案。
  • 样品验证:在批量采购前,建议进行样件测试(温度循环、加速老化、相位噪声/频谱分析等)以确认满足系统需求。

七、结论

XL2OI-111-19.2M 是一款面向工业与通信应用的高稳定性贴片晶振,凭借 19.2 MHz 的标准频率、±10 ppm 的初始频差与 ±20 ppm 的温度稳定性,适用于需要小体积、高可靠时钟源的各类电子系统。在实际工程中,请结合目标振荡器电路、PCB 布局与环境条件进行合理选型与调试,以确保最终系统时钟性能达到预期。

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