WMSIC Electronic Components

YXC X5032221184MRB2GI Crystal X5032221184MRB2GI

ModelX5032221184MRB2GI
PackageSMD5032-2P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC X5032221184MRB2GI
Type
YXC Yangxing Technology
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
X5032221184MRB2GI
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.153g
Frequency
22.1184MHz
Electronic Component
1
Electronic Component
BM0230878012
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
18pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X5032221184MRB2GI 产品概述

一、产品简介

X5032221184MRB2GI 为 YXC(扬兴科技)出品的贴片无源晶振,型号对应频率 22.1184MHz,封装形式为 SMD5032-2P(尺寸 5.0×3.2mm 双端子)。该器件为高性能通用时钟源,适用于通信、工业控制、消费电子及精密测量等对时钟精度有较高要求的场合。

二、主要规格

  • 晶振类型:贴片无源晶振(无源)
  • 标称频率:22.1184MHz
  • 常温频差:±10ppm(在标称温度点)
  • 频率稳定度:±30ppm(工作温度范围内)
  • 负载电容:18pF
  • 工作温度:-40℃ ~ +85℃
  • 封装:SMD5032-2P
  • 品牌:YXC 扬兴科技

三、核心特性

  • 频率精度高:常温频差±10ppm,适合对初始频率要求严格的系统设计。
  • 宽温度适应:-40℃至+85℃工作范围,满足绝大多数工业级应用环境。
  • 小型封装:SMD5032-2P 提供体积与性能的平衡,便于高密度 SMT 贴装。
  • 标准负载电容:18pF,便于与常见 MCU、FPGA、时钟电路匹配。

四、应用领域

  • MCU/MPU 时钟源、串口/UART 波特率基准
  • 通信设备与网络终端
  • 工业控制与自动化设备
  • 仪器仪表与测试测量系统
  • 消费类电子产品中的定时模块

五、设计与使用建议

  • PCB 布局:晶振与负载电容应尽量靠近芯片的晶振引脚,避免长引线及噪声耦合。地平面完整,走线短且成对对称布置。
  • 负载电容匹配:按器件标注的 18pF 选择外部负载电容并考虑封装引脚与 PCB 材料的寄生电容进行微调。
  • 焊接工艺:采用标准回流焊工艺,严格控制回流曲线以避免热冲击。焊后建议静置回流冷却后再进行电路通电测试。
  • 防护与存储:妥善防潮保管,遵循生产厂家的包装与保管建议,贴片前如为吸湿需经烘烤处理。

六、可靠性与选型提示

X5032221184MRB2GI 针对工业级应用进行了温漂与环境适配设计,但在高振动、高冲击或强电磁干扰环境中建议进行系统级验证。选择时关注频差、稳定度与工作温度是否满足目标系统长期漂移与精度要求。对相位噪声或抖动有严格需求的应用,建议在评估样品后与供应商确认更多动特性参数。

七、包装与订购

标准为托盘或卷带包装,便于 SMT 贴装线直接取料。订购时请确认整批次的频差与稳定度等级,并索取相关检验报告与样品以完成系统验证。若需异频或其他定制参数,可与供应商技术支持联系沟通。

以上为 X5032221184MRB2GI(YSX530GA 对应规格)产品概述,提供了主要参数、应用场景与使用建议,便于工程选型与集成设计。

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