Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
H6OSC-SUG-6M 为 YXC扬兴科技出品的贴片无源晶振,采用 HC-49S-SMD 封装,标称频率 6.000MHz。器件针对工业级和消费电子常见时钟源需求设计,工作温度范围为 -20℃~+70℃,在常温下频差为 ±20ppm,整体频率稳定度达到 ±30ppm,负载电容推荐 20pF。
H6OSC-SUG-6M 具备高频率准确性与良好的长期稳定性,适配常规低功耗振荡电路。封装体积小、厚度低,便于高密度 PCB 布局。无源结构便于与各类 MCUs、RTC、通信芯片配合使用,降低系统成本并提高可靠性。制造过程经过严格筛选,频率一致性好,输出抖动小,抗干扰性能优良。
适用于微控制器时钟源、通信模块、精密计时设备、消费类电子、工业控制器、测量仪器、无线终端及其他需稳定 6MHz 时钟的场合。
H6OSC-SUG-6M 兼容主流回流焊工艺。焊接时建议参照厂方推荐的热循环曲线,严格控制峰值温度与时间以确保性能与可靠性;避免在高温或长时间回流中多次重复焊接。贴装时注意焊盘尺寸与封装对齐,避免机械应力集中。清洗建议使用对晶体无腐蚀的清洗剂,尽量避免超声波清洗。
产品通过出厂频率筛选与温度漂移测试,满足长期漂移与振动冲击的工程要求。生产流程执行严格的来料检验、在线测试与最终老化筛选,以保证批次一致性与稳定性。建议在关键应用中进行最终电路级验证。
H6OSC-SUG-6M 可通过 YXC 扬兴科技及其授权代理订购,提供样品与量产供货服务。常见包装形式为卷带或托盘,便于贴片机贴装。具体技术资料、推荐焊接曲线与最小起订量请联系销售或查阅产品数据手册。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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