WMSIC Electronic Components

YXC X49SM12288MSD2SC Crystal X49SM12288MSD2SC

ModelX49SM12288MSD2SC
PackageHC-49S-SMD
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC X49SM12288MSD2SC
Type
YXC Yangxing Technology
Minimum package
1000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
X49SM12288MSD2SC
Electronic Component
1
Package
HC-49S-SMD
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.91g
Frequency
12.288MHz
Electronic Component
1
Electronic Component
BM0229976269
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X49SM12288MSD2SC 产品概述

一、产品简介

X49SM12288MSD2SC 为 YXC(扬兴科技)出品的一款无源贴片晶振,标称频率 12.288MHz,封装为 HC-49S-SMD。该器件为被动晶体元件,用于与外部振荡器电路(如 MCU、专用振荡器 IC 或分立反相器)配合产生稳定时钟信号,广泛应用于消费电子、通信、声频处理与嵌入式系统等场合。

二、主要规格参数

  • 类型:无源贴片晶振(HC-49S-SMD)
  • 标称频率:12.288 MHz
  • 常温频差:±20 ppm(25°C 参考)
  • 频率稳定度(频率随温度变化):±30 ppm
  • 负载电容:20 pF
  • 工作温度范围:-20°C ~ +70°C

三、特性与优势

  • 高频率精度高:常温±20 ppm,可满足对时序要求严格的数字与声频应用(例如采样、音频时钟同步)。
  • 贴片封装:HC-49S-SMD 适配自动化贴装和回流焊工艺,利于量产与组装可靠性。
  • 宽温区可用:-20°C 至 +70°C,适合大多数民用与工业轻度温控场景。
  • 被动设计:无需内部驱动,兼容多种振荡电路,灵活性强。

四、典型应用

  • 音频采样与系统时钟(12.288MHz 常用于音频采样率分频)
  • MCU/MPU 外部时钟源(需配合内部或外部振荡器电路)
  • 数字通信与同步电路
  • 声卡、DSP、编码/解码器等需精确时钟的设备

五、使用与布局建议

  • 负载电容匹配:采用对称电容 C1、C2 时,满足 CL = (C1·C2)/(C1+C2) + Cstray。若 C1=C2,则 C ≈ 2·(CL - Cstray)。以 CL=20 pF、PCB 寄生电容 Cstray 约 2–5 pF 为例,推荐每侧电容约 30 pF(可选 33 pF)。
  • 布局:晶体与两旁电容应尽量靠近振荡器输入脚,走线最短、对称并避开高频干扰源,底层建议接大面积地平面以降低寄生与 EMI。
  • 驱动功率:由于为无源晶体,应控制振荡器电路的驱动电平,避免超出晶体允许的驱动功率(参照厂商详细规格)。如有需要,可在驱动路径中加小阻抗(几十欧姆)以稳定启动与抑制过冲。
  • 焊接工艺:遵循回流焊温度曲线,避免长时高温暴露;存储前应防潮并在规定湿度条件下保管。

六、选型与注意事项

  • 若需更宽温区(如工业级 -40°C ~ +85°C)或更严苛频率稳定性,应选择相应温度等级或规格的产品。
  • 在高精度或长期漂移敏感的系统中,关注老化率与制造批次的一致性,必要时进行出厂筛选或标定。
  • 使用时务必参考扬兴科技完整数据手册,确认最大驱动功率、等效串联电阻(ESR)等关键参数。

七、可靠性与存储

  • 建议未封装前干燥箱内保存,避免潮气影响焊锡可靠性。
  • 出厂前经过常温测试并符合频差与稳定度指标;长期使用请关注环境温度对频率的影响并采用校准或补偿手段(例如温度补偿或软件校准)。

如需具体封装尺寸图、电气等效电路或数据手册 PDF,可提供型号请求以便获取扬兴科技原厂资料与评估支持。

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