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YXC X201626MLB4SI Crystal X201626MLB4SI
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC X201626MLB4SI
- Type
- YXC Yangxing Technology
- Minimum package
- 3000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- X201626MLB4SI
- Electronic Component
- 1
- Package
- SMD2016-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.02g
- Frequency
- 26MHz
- Electronic Component
- 1
- Electronic Component
- BM0229976265
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 9pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X201626MLB4SI 产品概述
一、产品简介
X201626MLB4SI 是扬兴科技（YXC）推出的一款贴片无源晶振，工作频率为 26.000 MHz，封装为 SMD2016-4P。该产品针对需要高精度时钟源的各类电子设备设计，具有小体积、低剖面、良好频率稳定性和可靠的焊接特性，适合表面贴装工艺（SMT）量产。
二、主要参数
- 晶振类型：无源贴片晶振（SMD）
- 标称频率：26.000 MHz
- 常温频差（初始容差）：±10 ppm（常温/出厂基准）
- 负载电容：CL = 9 pF
- 温度稳定度（频率随温度变化）：±20 ppm（工作温度范围内）
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装：SMD2016-4P
- 品牌：YXC 扬兴科技
三、产品特点
- 小尺寸封装，便于高密度贴装与小型化设计。
- 初始频差小，出厂校准严格，适用于对时钟精度有较高要求的系统。
- 在宽温区间内频率稳定，适合工业级环境应用。
- 无源结构，兼容绝大多数晶振输入的微控制器、射频芯片和时钟电路。
- 适配标准 SMT 工艺，可靠性高，便于自动化生产。
四、典型应用场景
- MCU / MPU 时钟源与系统参考时钟。
- 无线通信模块与射频前端的参考晶振（需评估 PLL 要求）。
- FPGA / CPLD 时钟输入，DSP 系统参考时钟。
- 消费电子、物联网终端、工业控制、智能家居、汽车电子（符合温度范围前提下）等。
五、使用与布局建议
- 参考晶振厂商提供的封装尺寸和推荐焊盘（Pad）布局图，以保证贴装良好与回流焊可靠性。
- 将晶振放置在振荡器输入引脚附近，走线尽量短且对称，减少寄生电容和噪声耦合。
- 推荐外接负载电容按 CL=9 pF 设计；实际两侧电容 C1、C2 可按 CL=(C1·C2)/(C1+C2)+Cstray 估算，考虑 PCB 寄生电容（通常每侧 2–3 pF），常见取值范围为 16–22 pF/侧，需在系统中验证频率偏移。
- 注意接地和屏蔽，避免数字或射频噪声耦合到晶振两端。
六、焊接与可靠性
- 建议采用标准 SMT 回流焊工艺，遵循晶振制造商的回流温度曲线和焊接规范，避免超温或过长加热时间影响性能。
- 在设计验证阶段进行实装测试（温度循环、振动、寿命老化测试等），以确认满足目标应用的长期稳定性与可靠性。
- 储存与搬运应防潮、防静电，遵循元器件常规保管要求。
七、订购与技术支持
产品型号：X201626MLB4SI（YXC 扬兴科技）。常规提供卷带（Tape & Reel）包装，支持批量供货。详细机械尺寸、引脚定义、回流曲线及完整电气特性请参阅扬兴科技官方 Datasheet 或联系厂商技术支持以获得最新资料与样品支持。
如需针对特定应用的匹配建议（如负载电容选型、PLL 参考设计注意事项或封装替代方案），可提供具体电路环境，我方可给出进一步的优化建议。
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