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YXC XC322512MOB4SA-18 Crystal XC322512MOB4SA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC XC322512MOB4SA-18
- Type
- YXC Yangxing Technology
- Minimum package
- 3000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- XC322512MOB4SA-18
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.08g
- Frequency
- 12MHz
- Electronic Component
- 1
- Electronic Component
- BM0230024968
- Operating Temperature
- 40℃~+125℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12pF
- Frequency
- ±80ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XC322512MOB4SA-18 产品概述
一、产品简介
XC322512MOB4SA-18 为 YXC（扬兴科技）出品的一款无源贴片晶振，工作频率为 12.000 MHz，面向需要高精度时钟源的微控制器、通信模块和精密计时应用。器件采用 SMD3225-4P 封装，体积小、可靠性高，适合自动化贴装和回流焊工艺。
二、主要特性
- 晶振类型：无源晶振（被动晶体谐振器）
- 名义频率：12.000 MHz
- 常温初始频差（T = 25°C）：±10 ppm
- 额定负载电容：12 pF
- 频率稳定度（含温度、老化等）：±80 ppm
- 工作温度范围：-40 ℃ 至 +125 ℃（适用工业/汽车级温区）
- 封装：SMD3225-4P（标准 3.2 × 2.5 mm 尺寸级别，四焊盘设计）
- 品牌：YXC 扬兴科技
三、典型规格说明
- 建议配套电路中使用两只对称的负载电容以满足 CL = 12 pF 的要求。按照常用估算公式（C1=C2≈2×(CL−Cstray)），当 PCB 寄生电容约 2–5 pF 时，单侧电容典型选用 18–22 pF 范围。
- 由于为无源晶体，振荡电路需由主控芯片或振荡器电路提供激励与偏置，驱动电平应遵循芯片及晶体的额定驱动能力，避免过高驱动导致频率漂移或老化加速。
- 推荐在 PCB 布局中将晶体与振荡器引脚靠近布置，走线尽量短且对地参考良好，以减少噪声耦合。
四、典型应用
- 单片机系统主时钟（MCU、DSP）
- 串行通信设备（UART、USB 相关时钟）
- 工业控制与仪表、车载电子、物联网终端
- 精密计时与频率参考模块
五、封装与机械信息
SMD3225-4P 提供小尺寸贴片形式，便于在高密度板上布局。四焊盘结构利于稳固焊接与可靠电气连接。具体焊盘图与外形尺寸请参见厂商机械图纸以保证匹配。
六、封装与焊接注意事项
- 遵循厂商回流焊建议曲线进行回流，避免超温或过长保温时间以减少频率漂移与机械应力；如无特别说明，推荐使用标准无铅回流工艺并控制峰值温度与时间。
- 焊前后避免强烈机械冲击和快速温度变化，防止谐振片损伤。
- 清洗时尽量使用对晶体无害的清洗剂并避免长期浸泡，若使用超声波清洗需与厂方确认可接受性。
- 在电路板设计中为晶体预留接地平面并避免信号线干扰，必要时可加阻抗匹配或滤波元件改善振荡稳定性。
七、选型与采购建议
XC322512MOB4SA-18 适合对温度范围和长期稳定性有较高要求的工业及车载应用。在采购前建议确认：工作温区、初始频差要求、系统所需负载电容值与驱动电平匹配，并向供应商索取完整数据手册（包含机械尺寸、频响曲线、老化特性及回流焊工艺规范）以便可靠应用。若需更高精度或特殊温漂等级，可与 YXC 技术支持沟通定制或等效替代方案。
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