WMSIC Electronic Components

YXC X5032221184MSB2GI Crystal X5032221184MSB2GI

ModelX5032221184MSB2GI
PackageSMD5032-2P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC X5032221184MSB2GI
Type
YXC Yangxing Technology
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
X5032221184MSB2GI
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.153g
Frequency
22.1184MHz
Electronic Component
1
Electronic Component
BM0059596244
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:X5032221184MSB2GI 无源晶振

概述

X5032221184MSB2GI 是一款高性能、无源贴片晶振,工作频率为 22.1184 MHz,主要由扬兴科技(YXC)生产。无源晶振广泛应用于电子设备中的时钟信号生成,其优越的频率稳定性和小型化设计使其成为现代电子产品如通信设备、消费电子及工业控制系统中的核心元器件。

技术规格

  • 频率:22.1184 MHz
  • 负载电容:20 pF
  • 频率偏移:±10 ppm
  • 封装类型:贴片封装(SMD5032)
  • 引脚数:5 引线
  • 品牌:YXC 扬兴科技

设计与功能

无源晶振的设计中,利用压电效应来实现高稳定性的振荡,并能在各种工作条件下保持频率的一致性。X5032221184MSB2GI 的典型负载电容为 20 pF,这使得其能更好地适应多种电路设计,尤其是在要求精确时钟信号的应用场景。其 ±10 ppm 的频率偏移表示该晶振在规定的温度和电压范围内,频率变化极小,从而确保了系统时钟的高精度与可靠性。

应用领域

X5032221184MSB2GI 晶振可广泛应用于以下几个领域:

  1. 通信设备:在移动电话、基站和各种无线路由器中,作为时钟信号源,确保数据的同步传输。

  2. 消费电子产品:例如数字音频播放器、视频监控设备和智能家居产品,晶振在这些设备中提供必要的时钟驱动,提升了产品的稳定性和用户体验。

  3. 工业控制系统:用于PLC(可编程逻辑控制器)、传感器和执行器等设备,确保数据处理的实时性和准确性。

  4. 汽车电子:随着汽车智能化程度的提升,X5032221184MSB2GI 在车辆的导航系统、车载娱乐系统中,也扮演着至关重要的角色。

设计优势

  1. 小型化设计:SMD5032 封装使得该晶振具有较小的体积,易于在空间有限的电路板上布局,适合于小型化设计的需求。

  2. 稳定性高:优良的频率稳定性使得其在温度变化、供电波动等环境因素下,能够保持优质的工作状态,提高电子设备的整体可靠性。

  3. 易于集成:无源晶振的简单连接方式使其与其他电路元件(如 MCU 和 FPGA)及相关接口的集成非常简单,不需要复杂的外部电路支撑,能够缩短产品开发周期。

结论

X5032221184MSB2GI 无源晶振是一款在频率稳定性、小型化以及易于集成方面具有显著优势的电子元器件。作为扬兴科技的一款代表性产品,其广泛的应用领域和卓越的性能,使其在高科技电子产品中占据了重要的地位。无论是用于通信设备、消费电子,还是工业和汽车应用,X5032221184MSB2GI 都能够为设计师和工程师提供可靠的时钟信号解决方案。选择 X5032221184MSB2GI,无疑是对产品性能和稳定性的一种保障。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.