WMSIC Electronic Components

YXC H6OSC-SUG-5.5296M Crystal H6OSC

ModelH6OSC-SUG-5.5296M
PackageHC-49S-SMD
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC H6OSC-SUG-5.5296M
Type
YXC Yangxing Technology
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
H6OSC-SUG-5.5296M
Electronic Component
1
Package
HC-49S-SMD
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.839g
Frequency
5.5296MHz
Electronic Component
1
Electronic Component
BM0226447321
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

H6OSC-SUG-5.5296M 产品概述

一、产品简介

H6OSC-SUG-5.5296M 是 YXC(扬兴科技)出品的一款无源贴片晶振,标称频率 5.5296 MHz,封装为 HC-49S-SMD。器件采用无源晶体谐振结构,适用于需高稳定时钟源的各类电子系统,具有体积小、互换性好、长期稳定性佳的特点。常温频差 ±20ppm,工作温度范围 -20℃~+70℃,频率稳定度 ±30ppm(含温度影响)。

二、主要参数与特性

  • 频率:5.5296 MHz
  • 常温频差(25℃):±20 ppm
  • 温度稳定度(全温区):±30 ppm(-20℃~+70℃)
  • 负载电容:20 pF(标称)
  • 类型:无源晶振(贴片)
  • 封装:HC-49S-SMD
  • 品牌:YXC 扬兴科技

器件为无源元件,需要配合目标电路(如 MCU 内部振荡器或专用振荡器电路)外接负载电容使用。HC-49S-SMD 封装便于回流焊工艺,适合标准 SMT 生产线。

三、典型应用场景

  • 工业与消费类微控制器时钟源
  • 通信与射频子系统局部振荡参考
  • 测量仪器与数据采集系统
  • 嵌入式计时、传感节点与网关设备
    该频率适合需要精确采样、分频或串口波特率校准的场合。

四、设计与选型建议

  • 负载电容匹配:标称 CL=20 pF。实际外接两只对称负载电容时,可按 CL = (C1·C2)/(C1+C2) + Cstray 估算。通常取 C1=C2 ≈ 30–36 pF(典型取 33 pF),根据板上走线及封装寄生电容适当调整。
  • 驱动与电平:为保护晶体长期稳定工作,应采用符合厂家驱动等级的低驱动设计,避免过驱动导致频率偏移或加速老化。
  • 焊接与工艺:建议遵循供应商回流焊曲线,避免超出峰值温度和急冷急热,回流后建议回流次数控制在合理范围内。
  • 布局注意:晶体附近避免强烈振动源、磁感应线圈或高频开关电路;用于敏感时钟线应短走线并做好接地屏蔽。

五、可靠性与注意事项

  • 存储与搬运时避免受潮、受力变形与强烈冲击;贴片焊接前避免弯曲引脚或施加机械应力。
  • 清洗与溶剂:尽量避免使用强溶剂长时间浸泡,必要清洗应选择对晶体封装安全的清洗方法并充分干燥。
  • 校准与验收:关键应用建议在最终环境温度下做频率验证,必要时进行温度补偿或校准处理以满足系统精度要求。

总结:H6OSC-SUG-5.5296M 以其稳定的频率特性、标准 SMD 封装和良好的互换性,适合各类要求中高精度时钟源的电子产品。选型时关注负载电容匹配、驱动等级与实际工作环境,可获得最佳性能与长期可靠性。若需更详细的回流焊曲线、驱动功率或老化特性,请参阅扬兴科技的产品资料或联系供应商技术支持。

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