WMSIC Electronic Components

YXC X50322712MSB2GI Crystal X50322712MSB2GI

ModelX50322712MSB2GI
PackageSMD5032-2P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
YXC X50322712MSB2GI
Type
YXC Yangxing Technology
Minimum package
1000

Technical parameters

Electronic Component
YXC
Electronic Component
X50322712MSB2GI
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.153g
Frequency
27.12MHz
Electronic Component
1
Electronic Component
BM0229976258
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X50322712MSB2GI 产品概述

一、产品简介

X50322712MSB2GI 为 YXC(扬兴科技)出品的无源贴片晶振,标称频率 27.12MHz,封装为 SMD5032-2P(5.0 × 3.2 mm,2 引脚)。该器件属低功耗、低剖面、适用于表面贴装工艺的高稳定性石英晶体元件,常用于需要稳定射频或时钟基准的便携及消费类电子产品。

二、主要参数

  • 工作频率:27.12MHz(无源晶体)
  • 常温频差:±10ppm(初始频差,常温下典型值)
  • 频率稳定度(温度变化):±20ppm(工作温度范围内)
  • 负载电容:20pF(CL)
  • 工作温度:-40℃ 至 +85℃
  • 封装:SMD5032-2P(贴片、两端接触)
  • 类型:无源晶振(需搭配振荡器电路或微控制器内部振荡器使用)

三、特性与优势

  • 高频率准确,可用于 27.12MHz 射频模块与时基要求较高的系统;
  • 小型贴片封装,兼容惯用的 SMT 回流工艺,便于批量制造;
  • 宽工作温度范围与良好的频率稳定性,适应工业级与消费类环境;
  • 标准负载电容 20pF,有利于与多数射频/时钟振荡器匹配。

四、电路与布局建议

  • 无源晶体需配合对应的振荡器 IC 或 MCU 内部振荡器使用;
  • 若外部两端需并联电容,按 CL = (C1·C2)/(C1+C2)+Cstray 计算,若 C1=C2,可取 C ≈ 2×(CL − Cstray)。以 CL=20pF、印制电路杂散电容 2–5pF 为例,单侧电容一般选 30–36pF;
  • 布局时将晶体与振荡器引脚及并联电容靠近布局,走线尽量短且避免穿过数字信号面;
  • 加强接地布线,避免在晶体下方布设大面积数字走线或高速信号,以减少干扰。

五、典型应用

  • 27.12MHz ASK/FSK/OOK 无线发射/接收模块(遥控、玩具、安防遥控);
  • 无线遥控、车库门、无线传感器、测距与短距离无线通信设备;
  • 需要稳定 RF 基准或时钟源的消费电子与工业设备。

六、选型与注意事项

  • 若系统对频率精度要求更高,应同时关注常温频差与全温区稳定度,两者可能叠加形成系统最大偏差;
  • 评估印刷电路板的杂散电容并据此调整并联电容值以确保振荡在期望负载下工作;
  • SMT 回流前遵循元件厂商的焊接温度和时间曲线,避免超出规定导致性能退化;
  • 储存与装配过程中注意防潮、防静电,避免机械应力影响频率特性。

七、可靠性与包装

YXC 扬兴科技提供批量生产的质量控制与出厂测试,常规提供卷带包装(Tape & Reel)以兼容贴片机自动贴装;在采购时可向供应商索取符合性文件(RoHS、出厂测试报告、频率曲线等)以满足生产与认证要求。

综上,X50322712MSB2GI 以其 27.12MHz 的稳定频率、20pF 负载规范与工业级工作温度,适合用于对射频基准或时钟有较高稳定性要求的贴片化产品设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.