WMSIC Electronic Components

YXC H6OSC-SUG-4.9152M Crystal H6OSC

ModelH6OSC-SUG-4.9152M
PackageHC-49S-SMD
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC H6OSC-SUG-4.9152M
Type
YXC Yangxing Technology
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
H6OSC-SUG-4.9152M
Electronic Component
1
Package
HC-49S-SMD
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.975g
Frequency
4.9152MHz
Electronic Component
1
Electronic Component
BM0226447323
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

H6OSC-SUG-4.9152M 产品概述

一、产品简介

H6OSC-SUG-4.9152M 为 YXC(扬兴科技)出品的无源贴片晶振,标称频率 4.9152MHz,封装为 HC-49S-SMD,面向对频率精度与温度稳定性有中等要求的通信与控制类产品。器件为无源晶体,需要与振荡器电路(如 MCU 内置振荡器或外部振荡器 IC)配合使用。

二、主要特性

  • 标称频率:4.9152MHz
  • 常温频差:±20ppm(室温校准)
  • 温度范围:-20℃ ~ +70℃
  • 频率稳定度(工作温区):±30ppm
  • 负载电容:20pF(CL)
  • 封装形式:HC-49S-SMD(贴片)
  • 类型:无源晶振(需外部振荡回路)

三、典型应用

  • 通信终端与基带时钟源
  • MCU/MPU 系统时钟与外围定时
  • 工业控制、仪器仪表的时基参考
  • 物联网模组、消费电子中对中频精度要求的场合

四、关键电气参数说明

  • 负载电容 CL=20pF:在 PCB 设计中须按 CL 值配合外部耦合电容,以确保振荡器频率准确。常用经验公式 C1=C2≈2×(CL−Cstray),若 PCB 寄生电容 Cstray≈2–5pF,则外部电容约 30–36pF。
  • 无源器件:器件本身不驱振,需选用合适的振荡器拓扑(常用 Pierce 架构)及偏置条件。
  • 频率公差:常温偏差用于出厂筛选;温度稳定度为器件在指定工作温度范围内的总偏差。

五、焊接与安装建议

  • 建议采用符合 IPC/JEDEC 的回流焊工艺,回流峰值温度 ≤260℃ 并控制高温区时长,避免重复高温循环。
  • 封装为 HC-49S-SMD,应在焊盘设计时考虑应力缓冲,避免振动或弯曲载荷对晶片造成机械应力。
  • 推荐在 SMT 贴装后尽量减少板弯和机械冲击,防止引脚应力导致频率漂移或失效。

六、设计与选型注意事项

  • 振荡器电路匹配:根据 MCU/振荡器 IC 的输入规格选择负载电容和偏置电阻,确保启动时间与振幅满足系统要求。
  • 环境适应性:工作温度仅覆盖 -20℃~+70℃,对更宽温区或高可靠性场合请咨询厂方或选用适配型号。
  • EMC 与走线:晶振附近避免高电平信号线,电源应有良好旁路与屏蔽,减少串扰影响频率稳定性。

七、质量、供应与支持

  • 品牌:YXC 扬兴科技,提供批量供货与质量追溯。
  • 选购时请确认频率公差与稳定度等级、封装形式与出厂测试报告。对于批量应用,可向供应商索取样片与加速老化或定制温度曲线服务。

如需电气等效模型、推荐外围电路图或回流焊曲线参数,可提供具体 PCB 与振荡器类型,我方可进一步给出优化建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.