WMSIC Electronic Components

YXC X503210MSB2GI Crystal X503210MSB2GI

ModelX503210MSB2GI
PackageSMD5032-2P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC X503210MSB2GI
Type
YXC Yangxing Technology
Minimum package
1000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
X503210MSB2GI
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
2.78g
Frequency
10MHz
Electronic Component
1
Electronic Component
BM0229913900
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X503210MSB2GI 产品概述

一、产品简介

X503210MSB2GI 是 YXC(扬兴科技)出品的一款无源贴片晶振,封装为 SMD5032-2P,标称频率 10.000MHz。该器件为石英晶体元件,无内部放大或驱动电路,需要与振荡器电路搭配使用,以实现稳定的参考时钟源。器件适用于空间受限且对频率精度有一定要求的消费电子、通信与测量设备。

二、主要参数

  • 类型:无源晶振(贴片晶振)
  • 标称频率:10.000 MHz
  • 常温频差(Initial Accuracy):±10 ppm(25°C)
  • 负载电容:20 pF
  • 频率稳定度(包含温度等影响):±30 ppm
  • 工作温度范围:-40°C ~ +85°C
  • 封装:SMD5032-2P(尺寸 5.0 × 3.2 mm 双引脚)
  • 品牌:YXC 扬兴科技

三、产品特性

  • 高频率精度高:常温初始偏差±10 ppm,适合对中长期精度有要求的系统参考源。
  • 宽温度范围:工业级 -40°C 至 +85°C,适应海量工业与车载类环境(需验证车规等级)。
  • 小型化封装:SMD5032-2P 有利于 PCB 布局紧凑与 SMT 自动化生产。
  • 无源结构:无内部驱动,配合外部振荡器电路灵活性高,适用于自定义频率控制方案。

四、典型应用

  • MCU、DSP 和 FPGA 的系统时钟参考
  • 通信设备本振或参考时钟(无线电、网络设备)
  • 精密计量、测量仪器与数据采集系统
  • 消费电子(导航、手持设备)和工业控制系统

五、设计与使用建议

  1. 由于为无源晶体,需配合合适的振荡器(如反相器或专用晶体振荡器 IC)。
  2. 建议在晶体两端并联两个等值负载电容,使每侧有效电容(含 PCB 寄生电容)接近 20 pF,以获得标称频率。常见做法:采用两个 33 pF~47 pF 的电容,具体值需考虑板上寄生电容并通过实际频率调试确定。
  3. PCB 布局:晶体应靠近振荡器 IC,避免长走线和高频数字干扰;将输入/输出引脚与晶体及其负载电容的回流路径最短化,并在周围设隔离区。
  4. 焊接工艺:遵循供应商推荐的回流温度曲线,避免过高温度或过长加热造成谐振频率漂移或损伤。
  5. 防静电与防潮:运输与处理过程中注意 ESD 防护与干燥保存。

六、封装与可靠性

SMD5032-2P 为业界常用贴片尺寸,适合 SMT 贴装与回流焊接。器件通过常规可靠性测试(随供应商说明),适配工业温度级别应用。关键可靠性指标(寿命、振幅衰减、焊接耐受)建议参考 YXC 官方详细数据手册。

七、订购信息与注意事项

型号:X503210MSB2GI;在选型时请核对频差、负载电容与温度等级是否满足目标系统要求。量产前建议向供应商索取样品并进行电路验证与温漂测试;对极端环境或关键应用应要求完整的认证与加速寿命测试报告。若需替代型号或定制规格,可联系扬兴科技技术支持获取更多选择。

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