WMSIC Electronic Components

YXC H6OSC-SUG-24M Crystal H6OSC

ModelH6OSC-SUG-24M
PackageHC-49S-SMD
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC H6OSC-SUG-24M
Type
YXC Yangxing Technology
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
H6OSC-SUG-24M
Electronic Component
1
Package
HC-49S-SMD
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.821g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0226447324
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

H6OSC-SUG-24M 产品概述

一、产品简介

H6OSC-SUG-24M 为 YXC(扬兴科技)出品的无源贴片晶振,标称频率 24.000 MHz,面向高可靠性、体积受限的常规时钟源应用。器件为贴片式 HC-49S-SMD 封装,便于自动贴装与回流焊工艺,适配各类 MCU、通信模块、DSP 及音视频处理等系统的主时钟需求。

二、主要电气参数

  • 频率:24 MHz
  • 常温频差(Initial tolerance):±20 ppm(25℃ 标称)
  • 工作温度范围:-20 ℃ ~ +70 ℃
  • 温度频率稳定度(含温漂、老化等因素的典型保证):±30 ppm(-20 ℃ ~ +70 ℃)
  • 负载电容(CL):20 pF
  • 类型:无源晶体(需外置振荡电路)

三、应用场景

H6OSC-SUG-24M 适用于:

  • 嵌入式控制板的系统时钟(MCU/FPGA)
  • 无线通信基带和射频子系统参考时钟
  • 数字音视频采集与处理时钟源
  • 工业控制、仪表与消费电子等需要稳定 24MHz 时钟的场合

四、设计与使用要点

  • 振荡器电路:因为为无源晶体,需配合微控制器内部振荡器或外部放大器(Pierce 型)及两只负载电容使用。若采用对称电容 C1=C2,则推荐取值近乎 2×(CL - Cstray),其中 Cstray(PCB 与封装寄生电容)通常约 2–5 pF,可据实际板级布局校准。
  • 串联限流/启动电阻:为保证稳定启动并控制驱动功率,可按系统厂商建议添加合适阻值的串联电阻。
  • 布局建议:晶振附近避免大面积铜皮、走线与高速信号,保持地线连续并将摆放位置靠近振荡放大器输入引脚,减小寄生电容与噪声耦合。
  • 焊接与回流:支持标准回流焊工艺;焊接时避免二次加热和长时间高温,以免影响性能。建议遵循厂方焊接曲线与清洗流程。

五、可靠性与品质保障

YXC 执行严格的出厂测试与筛选流程,保证频率初始偏差与温度稳定性能指标。出厂前通常进行温度循环和频率老化筛选,以确保批次一致性。对于关键应用可提供更详细的可靠性报告与追溯信息。

六、包装与订购信息

  • 品牌:YXC 扬兴科技
  • 型号:H6OSC-SUG-24M
  • 封装:HC-49S-SMD(贴片,适配自动贴装托盘或卷盘包装)
    订购时请注明频率、负载电容与封装类型,批量交付可提供长期供货与技术支持。

如需电气等效图、推荐 PCB 布局范例或回流焊曲线,欢迎提出具体需求,我方可提供配套资料与参考设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.