WMSIC Electronic Components

YXC X49SM18432MSD2SC Crystal X49SM18432MSD2SC

ModelX49SM18432MSD2SC
PackageHC-49S-SMD
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC X49SM18432MSD2SC
Type
YXC Yangxing Technology
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
X49SM18432MSD2SC
Electronic Component
1
Package
HC-49S-SMD
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.91g
Frequency
18.432MHz
Electronic Component
1
Electronic Component
BM0230877988
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X49SM18432MSD2SC 产品概述

一、产品简介

X49SM18432MSD2SC 为 YXC(扬兴科技)出品的无源贴片晶振,标称频率 18.432 MHz,适配 SMD 工艺的 HC-49S-SMD 封装。该器件为无源晶体元件,需配合外部振荡器电路(如 Pierce 架构的反相器或微控制器内部振荡器)使用,广泛用于对时基精度有较高要求的数字系统。

二、主要技术参数

  • 频率:18.432 MHz
  • 常温频差:±20 ppm(室温标称偏差)
  • 负载电容:20 pF(标称 CL)
  • 频率稳定度:±30 ppm(通常指温度范围内的综合稳定性)
  • 工作温度:-20 ℃ ~ +70 ℃
  • 封装:HC-49S-SMD(贴片型)
  • 类型:无源晶振

三、特点与优势

  • 精度适中:18.432 MHz 配合 ±20 ppm 常温频差,满足通信串口、计时等对分频精度要求高的应用。
  • 兼容性好:HC-49S-SMD 封装便于自动贴装与回流焊,适配主流 SMT 生产线。
  • 稳定性可靠:±30 ppm 的频率稳定度在典型商业温度范围内可提供稳定时基。
  • 成本与性能平衡:适合中低成本批量产品对时钟精度的需求。

四、典型应用

  • MCU 时钟与 UART/串口通讯(18.432 MHz 可整除常用波特率)
  • 工业控制与仪表计时电路
  • 通信设备中的本振或参考时钟
  • 需要外部精确时基的消费类电子与嵌入式系统

五、选型与电路建议

  • 作为无源晶振,需与一个反相器或专用晶振驱动器配合构成振荡回路,常用的为 Pierce 架构。
  • 负载电容选型:两端电容相等时,单个电容约等于 2×CL 减去 PCB 与引脚寄生电容(通常 2–5 pF)。以 CL=20 pF 为例,建议尝试 30–36 pF 的贴片电容并通过实际测量微调。
  • 布线与布局:晶体与两端电容应尽量靠近 MCU 或振荡器引脚放置,联线最短且避免与其他高速信号近邻布线,以减小干扰与寄生电容。
  • 驱动与老化:避免过大驱动电平以防止晶体过驱动和加速老化;长期频率漂移请按出厂老化数据与应用需求留有裕量。

六、封装与焊接提示

  • HC-49S-SMD 为贴片形式,应按照制造商推荐的回流焊温度曲线执行焊接工艺;如需手工焊接或二次加工,请遵循温度与时间限制以免损伤晶体。
  • 运输与存储时注意防潮、防静电;若长期存放或受潮,应按厂商建议进行干燥处理(请参考出货数据表)。

七、品质与供货

  • 建议在设计初期索取 YXC 的样品与完整数据手册进行验证测试;批量采购前可申请老化与可靠性报告以评估长期稳定性。
  • 对关键应用场合,建议在产品开发阶段进行环境与温度循环测试,确认在-20~+70 ℃ 工作范围内的频率表现满足系统要求。

如需更详细的电气特性、老化曲线、回流焊工艺或 PCB 推荐封装尺寸,请提供联系方式或直接向扬兴科技索取 X49SM18432MSD2SC 的官方技术资料与样品。

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