Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YXC H6OSC-SUG-4M Crystal Oscillator H6OSC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC H6OSC-SUG-4M
- Type
- YXC Yangxing Technology
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- H6OSC-SUG-4M
- Electronic Component
- 1
- Package
- HC-49S-SMD
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.447g
- Frequency
- 4MHz
- Electronic Component
- 1
- Electronic Component
- BM0226447322
- Operating Temperature
- 20℃~+70℃
- Electronic Component
- ±20ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±30ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
H6OSC-SUG-4M 产品概述
一、产品简介
H6OSC-SUG-4M 为 YXC（扬兴科技）出品的一款无源贴片晶振，标称谐振频率 4.000 MHz，封装为 HC-49S-SMD。器件为无源晶体谐振器，需配合微控制器或专用振荡器电路工作，适用于对频率稳定性有较高要求的中低成本电子产品与模块设计。
二、主要技术参数
- 频率：4.000 MHz
- 常温频差（初始偏差）：±20 ppm
- 频率稳定度（全温区）：±30 ppm
- 负载电容：20 pF
- 工作温度范围：-20 ℃ ～ +70 ℃
- 晶振类型：无源、贴片晶振（SMD）
- 封装：HC-49S-SMD
- 品牌：YXC 扬兴科技
三、适用场景
- 微控制器（MCU）时钟源与系统时基
- 串口、通信模块与调制解调器的时钟参考
- 传感器采样、数据采集与低速定时应用
- 消费电子、家电控制板、一般工控设备（在规定温区内）
四、使用建议与电路注意事项
- 作为无源晶振，必须与外部振荡器电路（如 Pierce 架构）配合使用；常见实现为晶体两端接两只负载电容到地的典型电路。
- 负载电容选取：标称 CL=20 pF，则两侧匹配的电容值常取约 2×CL（并考虑电路寄生电容），推荐范围 33 pF ～ 47 pF（根据板上寄生电容适当调整）。实际设计应测量并验证振荡频率。
- 驱动与老化：晶体对驱动电平敏感，建议使用符合晶体规格的低驱动电路以延长寿命并减少频率漂移；常见晶振老化量级为每年若干 ppm，具体请参阅出厂数据。
- 安装与回流：支持表面贴装回流焊工艺，但请遵循供应商的焊接曲线与限制，避免过高温度和长时间加热导致性能退化或机械应力。
- 机械与静电防护：避免弯曲、挤压与强震动；装配与测试时做好 ESD 防护。
五、包装与合规
- 常见包装形式为卷带（Tape & Reel），便于自动贴装生产。
- 可根据采购需求提供 RoHS 等环保合规资料（具体以供应商出具为准）。
六、选型与注意事项
- 若工作环境超出 -20 ℃ ～ +70 ℃ 或对频率稳定度有更高要求，应选用工业级或温补晶振（TCXO/OCXO）或与供应商沟通定制方案。
- 设计时请保留调试空间，实际板级调试通过调整负载电容与驱动电路来达到所需频率精度和启动性能。
- 如需批量采购、样品测试或详细电气/机械参数（如等效电路参数、谐振阻抗、封装尺寸、回流焊曲线等），建议向 YXC 扬兴科技索取完整数据手册。
H6OSC-SUG-4M 以其稳定的频率输出、贴片封装与适中的规格，适合大部分对时钟精度有中等要求的电子产品，是成本与性能均衡的晶振选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
