WMSIC Electronic Components

YXC X201616MKB4SI Crystal Oscillator X201616MKB4SI

ModelX201616MKB4SI
PackageSMD2016-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
YXC X201616MKB4SI
Type
YXC Yangxing Technology
Minimum package
1000

Technical parameters

Electronic Component
YXC
Electronic Component
X201616MKB4SI
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.031g
Frequency
16MHz
Electronic Component
1
Electronic Component
BM0228574630
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
8pF
Frequency
±20ppm
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X201616MKB4SI 产品概述

一、产品简介

X201616MKB4SI 为 YXC(扬兴科技)出品的无源贴片晶振,封装规格 SMD2016-4P(约 2.0 × 1.6 mm)。标称频率 16.000 MHz,常温初始频差 ±10 ppm,频率在工作温度范围内的稳定度可达 ±20 ppm。该器件为无源晶体元件,需与外部振荡电路配合使用,适合对频率精度与尺寸有较高要求的嵌入式终端与消费类电子产品。

二、主要特性

  • 频率:16 MHz(无源晶体)
  • 封装:SMD2016-4P(微型贴片)
  • 负载电容:8 pF(CL)
  • 常温初始频差:±10 ppm
  • 频率稳定度:±20 ppm(工作温度范围内)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 品牌:YXC 扬兴科技

三、典型应用

适用于微控制器时钟源、通信模块、蓝牙/低功耗无线设备、消费电子、工业控制与传感器节点等需要 16 MHz 基准频率的场合。由于体积小、精度高,亦便于移动设备与空间受限的 PCB 布局。

四、使用建议与电路匹配

  • 晶体为无源件,需与 MCU 或振荡器芯片的两端并联必要的负载电容以构成振荡回路。
  • 负载电容选择参考:CL = (C1·C2)/(C1+C2) + Cstray。若 PCB 杂散电容 Cstray 取 1–2 pF,建议 C1 = C2 ≈ 12 pF 左右(实际以振荡器厂商应用手册为准)。
  • 封装贴装时应采用短且对称的走线,避免长引线和大面积信号回路,晶体附近宜保留完整地铜平面以利接地与屏蔽。
  • 装配与焊接兼容常见的 SMT 回流工艺,存放与操作应防潮、防静电、避免机械冲击。

五、可靠性与注意事项

  • 工作温度范围 -40~+85 ℃,在该范围内可保持标称稳定度;超出范围需评估频率漂移与可靠性。
  • 使用过程中应注意 ESD 保护与预防震动对频率的瞬时影响。
  • 选型时请确认振荡器芯片对晶体等参数的匹配,必要时通过样片验证启动时间、振幅与相噪等指标。

如需封装尺寸图、焊盘推荐或更多电气参数(如等效串联电阻 ESR、驱动等级、老化率等),可向供应商或扬兴科技获取详细数据手册,以便在具体设计中完成最终匹配与验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.