Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X49SM10MSD2SC 是由扬兴科技(YXC)生产的一款高性能无源晶振,属于贴片晶振系列。该产品以其卓越的频率稳定性和广泛的工作温度范围,成为电子设备中的理想选择。
X49SM10MSD2SC 无源晶振具有极高的频率精度,常温频差仅为 ±20 ppm,整个工作温度范围内的频率稳定度为 ±30 ppm。这使得它特别适用于要求高精度的电子设备,如通信设备、计算机系统、工业控制器和医疗设备等。
该晶振支持 -20℃ ~ +70℃ 的广泛工作温度范围,这使得它能够在各种环境条件下稳定运行,无论是在极冷的工业环境还是在高温的户外应用中,都能保持其性能。
采用 HC-49S-SMD 贴片封装,X49SM10MSD2SC 具有紧凑的体积和轻便的设计,非常适合现代电子产品的miniaturization趋势。这种封装方式还提高了生产效率和可靠性,减少了手动焊接错误的可能性。
负载电容为 20 pF,这是一个相对较低的值,能够减少对外围电路的影响,并且有助于简化设计过程。低负载电容还意味着更低的功耗和更高的能效,这对于 battery-powered 设备尤其重要。
在通信设备中,稳定的时钟信号对于数据传输和接收至关重要。X49SM10MSD2SC 的高频率精度和稳定性使其成为基站、无线路由器、调制解调器等通信设备的理想选择。
计算机系统需要高精度的时钟信号来确保数据处理和传输的准确性。该晶振可以用于主板、服务器、嵌入式系统等各种计算机应用中。
工业控制器需要在恶劣环境下运行,而 X49SM10MSD2SC 的宽工作温度范围和高频率稳定度使其成为工业自动化、机器人控制、PLC 等领域的首选。
医疗设备对精度和可靠性有非常高的要求。X49SM10MSD2SC 可以用于心率监测仪、超声波扫描仪、MRI 机等医疗设备中,确保数据的准确性和可靠性。
X49SM10MSD2SC 无源晶振是扬兴科技推出的一款高性能产品,通过其卓越的频率精度、广泛的工作温度范围和紧凑的贴片封装,成为各种电子设备中的理想选择。无论是在通信、计算机系统、工业控制还是医疗领域,X49SM10MSD2SC 都能提供可靠和高精度的时钟信号,满足不同应用场景下的需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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