WMSIC Electronic Components

YXC O9705040MEDA4SI Crystal Oscillator O9705040MEDA4SI

ModelO9705040MEDA4SI
PackageSMD7050-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC O9705040MEDA4SI
Type
YXC Yangxing Technology
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
O9705040MEDA4SI
Electronic Component
1
Package
SMD7050-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.2g
Frequency
40MHz
Electronic Component
1
Electronic Component
BM0230877097
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V
Electronic Component
±20ppm
Output
CMOS
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

O9705040MEDA4SI 产品概述

O9705040MEDA4SI 是 YXC(扬兴科技)系列中的一款表面贴装晶体振荡器,型号对应 YSO690PR 40MHz。该器件以 3.3V 工作电压、CMOS 输出模式和高精度频率规格为特点,适用于对系统主时钟或外设时钟有较高稳定性要求的电子产品。器件封装为 SMD7050-4P,适合回流焊贴装与自动化生产。

一、主要参数与特性

  • 标称频率:40.000 MHz
  • 常温频差(Initial Accuracy,25℃):±20 ppm
  • 频率稳定度(包括温度、负载及长期漂移等):±30 ppm(典型或上限参数,具体请以厂商数据手册为准)
  • 输出模式:CMOS(方波,逻辑电平兼容 3.3V 系统)
  • 工作电压:3.3 V
  • 工作温度范围:-40 ℃ ~ +85 ℃(工业级温度范围)
  • 封装形式:SMD7050-4P(表面贴装,4 引脚)
  • 描述:晶振 YSO690PR 40MHz 3.3V 20PPM,品牌 YXC(扬兴科技)

二、封装与机械信息

  • 尺寸说明:SMD7050 指示器件外形约为 7.0 mm × 5.0 mm(具体引脚尺寸与焊盘布局请参照厂家机械图纸)。“4P”表示 4 引脚布局,适用于双面贴装。
  • 贴装工艺:兼容标准回流焊工艺,建议按照厂方给出的回流曲线与焊接注意事项执行以保证焊接可靠性与器件性能稳定。
  • 引脚功能:一般包括 VCC、GND、输出(或输出对)及可能的控制/地连接,具体引脚定义请参考器件引脚图与接线建议。

三、典型应用场景

该 40MHz CMOS 晶振适合多种需要稳定时钟源的电子系统,包括但不限于:

  • 嵌入式处理器、微控制器和 DSP 的系统时钟
  • 通信设备:如以太网 PHY、串行通信接口的参考时钟
  • 工业控制与测试测量设备,要求宽温工作与稳定频率的场合
  • 消费电子或车规周边设备中对 3.3V CMOS 时钟输入的模块
  • FPGA、ASIC 的外部时钟输入(需确认抖动与驱动能力满足目标芯片规格)

四、应用建议与注意事项

  • 电源与去耦:为保证输出时钟质量与频率稳定性,VCC 端应靠近器件布置 0.1 μF(或厂方建议值)贴片去耦电容,并连接到良好接地平面。
  • 地平面与布线:优先使用连续的接地平面,输出线尽量短且避免与高速信号平行长距离耦合,必要时使用阻抗控制与串联终端以降低反射和干扰。
  • 负载匹配:CMOS 输出通常直接驱动数字输入;若需驱动多个负载或长距离线路,请确认器件驱动能力与上拉/下拉要求。若系统对相位噪声/抖动有严格要求,请咨询厂方抖动指标或选用专用时钟发生器。
  • 温度与频偏:常温频差为 ±20 ppm,整体频率稳定度 ±30 ppm(含温度影响),在关键时钟设计中需将该稳定度纳入时序和容差评估。
  • 焊接与保管:遵循厂家推荐的回流焊曲线,避免超出温度/时间极限;元器件应在规定条件下存储以防潮湿导致焊接或性能问题。

五、选型与订购建议

  • 型号选择:O9705040MEDA4SI(对应 YSO690PR 40MHz 3.3V 20PPM)适合需 40MHz CMOS 输出、3.3V 供电和工业温度等级的应用。若需要更高精度、较低抖动或可编程输出,请咨询扬兴科技提供的其他系列或定制选项。
  • 样片与验证:在批量采购前建议申请样片并在目标系统中进行电磁兼容(EMC)、抖动/相位噪声、热循环与长期稳定性测试。
  • 量产交期与包装:请向供应商确认最小订购量、交货期、包装方式(带卷带或托盘)以及是否提供追溯信息(批次、出厂测试记录)。

六、质量与可靠性建议

  • 环境适应性:器件工作温度覆盖 -40 ~ +85 ℃,适用于工业级环境;若用于更严苛环境(高温、车辆环境)请确认是否有车规认证或更高等级型号。
  • 可靠性验证:建议在产品开发阶段进行温度循环、振动、跌落与长期老化测试,以验证在目标应用中的长期频率稳定性与机械可靠性。
  • 技术支持:在特殊应用(如低抖动、高驱动负载或多输出同步)中,建议与扬兴科技技术支持沟通获取更详细的电气特性、引脚定义与应用方案。

总结:O9705040MEDA4SI(YSO690PR 40MHz)是适用于 3.3V CMOS 系统的高精度表面贴装晶振,兼顾工业温度范围和贴片生产适配性。选型时请结合系统对频率精度、稳定度与抖动的具体要求,并参照厂家完整数据手册和焊接指南完成验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.