WMSIC Electronic Components

YXC OT322514.31818MJBA4SL Crystal Oscillator OT322514.31818MJBA4SL

ModelOT322514.31818MJBA4SL
PackageSMD3225-4P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC OT322514.31818MJBA4SL
Type
YXC Yangxing Technology
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
OT322514.31818MJBA4SL
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.04g
Frequency
14.31818MHz
Electronic Component
1
Electronic Component
BM0257262939
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.3V
Electronic Component
±10ppm
Output
CMOS
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

OT322514.31818MJBA4SL 产品概述

一、产品简介

OT322514.31818MJBA4SL 是 YXC(扬兴科技)出品的一款贴片有源晶振(SMD3225-4P 封装),标称频率 14.31818 MHz,输出为 CMOS 电平。器件为有源一体化晶振,内置振荡电路,外部无需附加元件,适合对频率精度与可靠性有要求的中高端电子设备。

二、主要性能参数

  • 频率:14.31818 MHz
  • 常温频差:±10 ppm
  • 频率稳定度:±20 ppm(含温度与负载等综合误差)
  • 输出模式:CMOS 输出
  • 工作电压:1.8 V 至 3.3 V(支持单电源多电平系统)
  • 工作温度:-40 ℃ 至 +85 ℃
  • 封装:SMD3225-4P(贴片封装,尺寸 3.2 mm × 2.5 mm)

三、产品特性

  • 集成度高,内部振荡电路优化,免外接晶体或负载电容,简化电路设计。
  • 宽电压范围(1.8V-3.3V),兼容多种逻辑电平,便于在低功耗和传统系统间切换。
  • 可靠性优良,工作温度范围覆盖工业级应用。
  • CMOS 输出适配微控制器、通信芯片和时钟管理器,输出驱动能力适中,抗干扰能力较强。

四、典型应用

  • 单片机与微处理器系统时钟源
  • 通信设备、网络设备时钟和采样参考
  • 数字视频与广播系统(14.31818 MHz 常用于特定视频/编码时钟)
  • 测试测量设备、工业控制与仪表等需稳定时基场景

五、封装与焊接建议

SMD3225-4P 小型贴片封装,推荐回流焊工艺。焊接时注意:

  • 依据封装热敏性选择合理回流温度曲线,避免超时高温。
  • PCB 布局时为晶振留出必要的地平面和隔离区,减少数字回流干扰,确保信号完整性。
  • 输入电源应加旁路电容以降低电源噪声对频率稳定性的影响。

六、选型与注意事项

  • 若系统对相位噪声或抖动有严格要求,请在选型时与供应商确认噪声规格与测试条件。
  • 频差和稳定度需结合实际工作温度和电源环境评估,必要时在目标系统中做最终验证。
  • 长期存储或高湿度环境中,应遵循器件防潮包装与回流前干燥规定。

OT322514.31818MJBA4SL 以其稳定的频率性能、宽工作电压和工业级温度范围,适合需要可靠时钟源的各类电子产品,便于工程师在原型与量产阶段快速集成与验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.