Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YXC X49SM12MSB2SC Crystal Oscillator X49SM12MSB2SC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC X49SM12MSB2SC
- Type
- YXC Yangxing Technology
- Minimum package
- 1000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- X49SM12MSB2SC
- Electronic Component
- 1
- Package
- HC-49S-SMD
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 1.016g
- Frequency
- 12MHz
- Electronic Component
- 1
- Electronic Component
- BM0229913902
- Operating Temperature
- 20℃~+70℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±30ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X49SM12MSB2SC 产品概述
一、产品简介
X49SM12MSB2SC 为 YXC（扬兴科技）出品的贴片无源晶振，标称频率 12.000MHz，专为微控制器、通信模块和时钟电路提供稳定的基准时钟源。本器件采用 HC-49S-SMD 封装，结合贴片工艺，便于 SMT 生产线自动化组装，适合空间受限但对频率精度有一定要求的电子产品。
二、主要性能参数
- 晶振类型：无源贴片晶振（SMD）
- 标称频率：12.000 MHz
- 常温频差（Initial tolerance）：±10 ppm（室温）
- 负载电容（CL）：20 pF
- 频率稳定度（含温度变化等）：±30 ppm
- 工作温度范围：-20 ℃ ~ +70 ℃
- 封装：HC-49S-SMD
- 品牌：YXC 扬兴科技
（以上参数以出厂规格为准，具体请参见厂方数据手册）
三、典型应用场景
- 微控制器（MCU）时钟源与系统时基
- 无线通信模块、射频前端参考源
- 消费类电子（数码相机、智能家居）
- 工业控制与仪表类设备（在指定温度范围内）
- 需要小尺寸、低功耗且频率稳定的场合
四、设计与使用建议
- 负载电容匹配：晶体标称 CL=20 pF。若使用对称并联电容 C1=C2，则推荐每边电容约为 2×(CL−Cstray)。考虑到 PCB 与引脚寄生电容（Cstray 常见 2–5 pF），可选择 27 pF–33 pF 的并联电容作为起始值，后续以实际频率校准微调。
- 接地与走线：晶体两端走线尽量短且对称，靠近 MCU 的晶振输入/输出脚放置，附近避免高速信号线、开关电源噪声与大电流回流路径，保证良好接地以降低相位噪声与抖动。
- 驱动等级：无源晶体对驱动电平敏感，应按器件说明与系统器件（如 MCU 的振荡器电路）匹配，避免过驱动以减少加速老化。
- 回流焊与存储：HC-49S-SMD 适用于常规回流工艺，建议遵循 YXC 数据手册中的回流曲线与预热/回流峰值温度限制；长时间存储请按干燥密封环境，避免潮湿与机械应力。
五、封装与可靠性
HC-49S-SMD 兼具传统 HC-49 的电气特性与贴片装配优势，适配自动贴装与回流流程。YXC 对品质控制有严格出厂测试，包括频率测试、温度循环与老化筛选，确保在标称工作温度范围与频率稳定度下满足工业级应用需求（具体可靠性数据请参阅厂方可靠性报告）。
六、订购信息与注意事项
- 型号：X49SM12MSB2SC（请在采购时核对完整型号与规格）
- 若需更宽温度范围、更高频率稳定度或不同封装，请向供应商索取替代型号或定制选项。
- 采购前建议获取并核对 YXC 提供的最新数据手册和样品进行电路验证，以确保在目标应用中达到预期性能。
如需进一步的电路匹配示意图或在特定 MCU/振荡器配置上的实测建议，可提供目标芯片型号与 PCB 原理图以便给出更具体的设计指导。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
