Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X503216MSB2GI是一款由YXC扬兴科技生产的无源晶振,工作频率为16MHz,具有低负载电容(20pF)和高频率稳定性(±10ppm)。此晶振采用SMD5032封装,专为高性能电子应用而设计,适用于现代通信、消费电子和工业设备等多个领域。
高稳定性:X503216MSB2GI的频率稳定性为±10ppm,确保其在各种环境条件下能够保持稳定的输出频率。这种特性对于需要精确时钟信号的应用至关重要,能够有效降低系统出错的可能性。
适用宽温范围:该晶振的工作温度范围通常为-40℃至+85℃,使其能够在多种恶劣环境下稳定工作,特别适用于工业、汽车电子及连接设备等领域。
小型封装:SMD5032-2P封装使得该晶振在空间有限的电路板设计中具有优良的适应性,支持高密度的电子产品设计。其小巧的尺寸使其可方便贴装到各种PCB上,符合现代电子产品对体积和重量的要求。
通信设备:X503216MSB2GI可用于手机、路由器、基站等通信设备中,提供稳定的时钟信号,确保数据传输的可靠性和稳定性。
消费电子:在数字音频、视频处理及任何需要稳定时序的消费电子产品中,X503216MSB2GI能够有效提升产品的性能。
工业控制:在工业自动化系统、嵌入式设备及控制电路中,因其优良的稳定性和宽温特性,该晶振可用作实时定时器、计时器或其他需要精确时钟的应用。
贴装方法:建议使用标准的表面贴装技术(SMT)进行安装,确保焊点牢固,避免由于机械震动造成的损坏。
PCB设计:在设计PCB时,需根据晶振的负载电容要求,合理设计相关的电路,以确保其工作在最佳状态。同时,应避免在晶振附近布置高频信号线,减少干扰对晶振性能的影响。
测试与验证:在批量生产之前,建议对晶振的频率及其稳定性进行测试,以验证其符合设计要求,并确保在实际应用中的可靠性。
X503216MSB2GI无源晶振凭借其高频率稳定性、小巧的SMD5032封装和宽广的应用范围,成为工业及消费电子领域中一款理想的时钟信号产生器。YXC扬兴科技凭借其优质的晶振产品,不断推动着电子产品的小型化与高性能化,是广大设计工程师及产品开发者不可或缺的合作伙伴。通过选择X503216MSB2GI,客户能够在设计中获得更高的可靠性与性能保障,助力最终产品的成功上市。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products