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YXC X50322863636MSB2GI Crystal Oscillator X50322863636MSB2GI
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC X50322863636MSB2GI
- Type
- YXC Yangxing Technology
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- X50322863636MSB2GI
- Electronic Component
- 1
- Package
- SMD5032-2P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.153g
- Frequency
- 28.63636MHz
- Electronic Component
- 1
- Electronic Component
- BM0230877989
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X50322863636MSB2GI产品概述
一、产品简介
X50322863636MSB2GI为YXC（扬兴科技）出品的一款贴片无源晶振，标称频率28.63636MHz，封装为SMD5032-2P（典型尺寸5.0×3.2mm）。此器件以小型化、低损耗和高频率精度为设计目标，适用于需要稳定时钟源的消费类与工业类电子设备。
二、核心规格
- 晶振类型：贴片无源晶振（Quartz）
- 频率：28.63636 MHz
- 常温频差（25℃）：±10 ppm
- 频率稳定度（温度范围内）：±30 ppm
- 负载电容：20 pF
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装：SMD5032-2P
- 品牌：YXC 扬兴科技
三、主要特点
- 高频率精度高，25℃下常温偏差仅±10ppm，配合温度稳定性可保证系统长时间稳定运行；
- 小型SMD封装，适合高密度贴装与自动回流焊；
- 20 pF的标准负载电容，便于与常见MCU/PLL输入接口直接匹配；
- 工作温度范围宽，满足-40℃到+85℃的工业级环境需求。
四、典型应用场景
- 无线通信与射频前端（作为PLL参考源）；
- 工业控制与计量设备；
- 高速串行接口与时序敏感的数字系统；
- 消费电子、导航及测试测量仪器中对频率稳定性有要求的场合。
五、布局与使用建议
- 晶振应尽量靠近目标芯片的晶振输入引脚安放，走线最短、对称；
- 推荐为两端接入与负载电容匹配的旁路电容，考虑PCB寄生电容（一般取2–5 pF），常用电容值可选27–33 pF以实现等效20 pF负载；
- 避免将高频或大电流走线穿过晶振附近，减少干扰；
- 采用标准无铅回流工艺焊接，焊接温度曲线应参考扬兴科技的技术资料。
六、可靠性与检验
产品在出厂前经过频率测试与温度漂移筛选，满足标称频差与温度稳定度要求。建议在关键应用中做批次抽检与老化测试，以确保长期可靠性。
七、选型与采购建议
在选型时确认系统对负载电容、温漂与驻波裕度的具体要求；若系统对频偏或相位噪声有更高要求，可咨询供应商提供更高规格的系列或定制化服务。购买时请提供完整型号X50322863636MSB2GI以确保得到对应封装与测试等级。
如需完整数据手册（包括等效电路、典型驱动电平、回流焊曲线与详细机械尺寸），请联系YXC扬兴科技或授权分销商获取最新技术文件。
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