WMSIC Electronic Components

YXC X49SD16MSB2SI Crystal Oscillator X49SD16MSB2SI

ModelX49SD16MSB2SI
PackageHC-49S
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
YXC X49SD16MSB2SI
Type
YXC Yangxing Technology
Minimum package
200

Technical parameters

Electronic Component
YXC
Electronic Component
X49SD16MSB2SI
Electronic Component
1
Package
HC-49S
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.574g
Frequency
16MHz
Electronic Component
1
Electronic Component
BM0228574648
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
Through-hole Crystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
200

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X49SD16MSB2SI 产品概述

一、产品简介

X49SD16MSB2SI 为 YXC(扬兴科技)出品的无源直插式晶体谐振器,工作频率为 16.000 MHz。器件采用经典 HC-49S(直插)封装,适用于需要高稳定性时钟源的各类电子系统。该型号以低温漂、高可靠性和适配常见微控制器外部振荡电路为主要特点,是通用型频率基准的理想选择。

二、主要性能参数

  • 类型:无源晶振(被动元件)
  • 型号:X49SD16MSB2SI
  • 频率:16.000 MHz
  • 常温频差(经校准):±10 ppm(25℃)
  • 频率稳定度(温度范围内):±30 ppm
  • 负载电容(CL):20 pF
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:HC-49S(直插)
  • 品牌:YXC 扬兴科技

三、产品特点与优势

  • 频率精度高:常温频差仅 ±10 ppm,可满足对时基精度要求较高的应用场景。
  • 温度适应性好:在-40 ℃ 至 +85 ℃ 工作温度范围内,频率稳定度 ±30 ppm,适合工业级环境。
  • 标准负载电容:20 pF 负载电容设计便于与主流微控制器和振荡电路配合使用。
  • 直插 HC-49S 封装:封装坚固、安装方便,便于手工装配或波峰焊接的通用线路板设计。
  • 品牌支持:YXC 扬兴科技具有成熟的晶体振荡器制造与质量控制体系,可提供稳定供应与技术支持。

四、典型应用场景

  • 微控制器外部时钟(如 AVR、PIC、ARM 等需要 16 MHz 的 MCU)
  • 工业控制与自动化设备
  • 通信设备与接口模块
  • 精密计时与测量仪器
  • 消费电子产品(时钟、计时器、音视频同步等)

五、使用建议与电路匹配

  • 与 MCU 或振荡器电路配合时,建议按振荡器芯片手册选用两只与晶体等效的负载电容 C1、C2,满足等效负载电容 CL ≈ 20 pF。计算近似关系为:CL ≈ (C1·C2)/(C1 + C2) + Cstray(Cstray 为 PCB 与引线寄生电容,通常数 pF)。
  • 为保证振荡稳定启动并防止过驱动,建议参考目标振荡器芯片的驱动电平与串联限流电阻(若有需要,可在晶体一端串联小阻值)。
  • PCB 布局:晶体应尽量靠近振荡器输入脚放置,连接线尽量短且对称,旁边避免高速数字走线和大电流回路,保证接地良好,必要时在晶体附近形成地铜区域以降低噪声干扰。

六、可靠性与存储注意事项

  • 长期漂移(老化):晶体会随时间产生微小漂移,具体老化速率与工作环境、贮存条件及制造批次有关;对长期高精度需求的项目建议定期校准或选择有明确老化规格的器件等级。
  • 存储与焊接:避免在高温高湿环境长期存放,焊接时遵循供应商焊接工艺建议,避免过高温度和过长焊接时间对晶体造成热应力。波峰或手工焊接后应冷却到室温并避免机械应力施加到引脚或封装上。
  • 机械与振动:虽然 HC-49S 封装结构较为结实,但仍应避免强烈的冲击和持续剧烈振动,以免造成频率漂移或损坏。

七、选型与质量认证建议

  • 在批量选型前建议向供应商确认所有电气、机械与环境规格(包括老化率、封装引脚间距、焊接温度曲线、RoHS 符合性等),并索取样品进行实测验证。
  • 若应用需满足特定认证(如工业等级筛选或军工级别),请与 YXC 扬兴科技的技术支持联系,获取相应的测试报告与筛选服务。

如需该型号的电气等效电路图、具体引脚外形尺寸或量产采购信息,可提供明确需求,我可以帮助整理并给出进一步的技术建议。

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