Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YXC X252024MRB4SI Crystal Oscillator X252024MRB4SI
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YXC X252024MRB4SI
- Type
- YXC Yangxing Technology
- Minimum package
- 3000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YXC
- Electronic Component
- X252024MRB4SI
- Electronic Component
- 1
- Package
- SMD2520-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.041g
- Frequency
- 24MHz
- Electronic Component
- 1
- Electronic Component
- BM0230025010
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 18pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X252024MRB4SI 产品概述
一、产品简介
X252024MRB4SI 是一款贴片无源晶振，适用于对时钟精度和体积有较高要求的电子设备。由 YXC（扬兴科技）生产，封装为 SMD2520-4P（四焊盘小外形），工作频率 24.000 MHz。该器件为无源元件，需要外部振荡电路（MCU 或专用振荡器）配合使用，适合现代表贴化生产线和自动回流焊工艺。
二、主要规格
- 类型：贴片无源晶振（SMD）
- 频率：24.000 MHz
- 常温频差（Initial Tolerance）：±10 ppm（常温）
- 负载电容：18 pF（标称）
- 频率稳定度（含温度影响）：±20 ppm
- 工作温度范围：-40 ℃ 到 +85 ℃
- 封装：SMD2520-4P（约 2.5 × 2.0 mm）
- 品牌：YXC 扬兴科技
三、产品特性
- 体积小、重量轻，适合集成度高的移动终端与嵌入式系统。
- 优良的频率稳定性和温度范围，适合工业级应用。
- 标准化 SMD 封装，兼容自动贴片及回流焊装配。
- 无源设计，低功耗系统中与微控制器或振荡器模块配合灵活。
四、典型应用场景
- 微控制器与单片机时钟源（UART、SPI、I2C 定时）
- 通信设备、无线模块的本振参考（需依据系统要求设计匹配电路）
- 工业控制、汽车电子子系统（在符合温度与稳定度要求的场景）
- 精密计时、测量仪器与消费类电子产品
五、封装与安装建议
- 封装为 SMD2520-4P，建议参考厂家推荐的 PCB 焊盘布局，器件焊盘间应留有足够的焊膏覆盖以保证力学和电气可靠性。
- 晶振与 MCU/振荡器引脚应尽量靠近布置，减少焊盘走线长度和寄生电容。
- 负载电容应按 18 pF 标称值在晶振两端与地之间各并联一个匹配电容，尽量使用低ESR、低温漂陶瓷电容并放置在靠近器件引脚的位置。
- 推荐遵循厂家回流焊工艺指南进行焊接，避免过度热循环和机械应力。
六、品质与可靠性
X252024MRB4SI 设计用于在 -40 ～ +85 ℃ 工况下长期稳定工作，常温频差与频率稳定度指标满足多数工业与消费类设计需求。出厂前通常经过频率、外观、电气连通性等测试；建议在关键应用中与供应商确认老化（Aging）、等效串联电阻（ESR）等完整电参数。
七、选型与替代
在选型时，请确认系统是否需要无源晶体（需外部振荡电路）或有源晶体振荡器（内部驱动、输出方波）。若需不同频差、不同负载电容或耐更宽温度范围的器件，可与供应商沟通匹配型号或定制选项。
八、注意事项
- 储存与搬运过程中应防潮、防尘、防静电；避免跌落和强冲击。
- 安装前确认 PCB 焊膏量与回流曲线，避免过高峰温或过长保温时间。
- 使用时应考虑外部电路的驱动能力与相位噪声需求，必要时进行系统级验证。
如需器件详细电参数（如 ESR、老化率、典型等效电路图及回流焊曲线），建议向供应商索取完整数据手册与封装图纸以便在设计与制程中参考。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
