WMSIC Electronic Components

YLPTEC SCM3725ASA

ModelSCM3725ASA
PackageSOIC-8
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC SCM3725ASA
Type
YLPTEC
Minimum package
2500 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
SCM3725ASA
Electronic Component
1
Package
SOIC-8
Electronic Component
Isolated
Electronic Component
0.098g
Electronic Component
1
CMTI(kV/us)
100kV/us
Features
Output
Electronic Component
BM0257677002
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
1
Channel Count
1
(tpd)
8ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SCM3725ASA 产品概述

一、产品简介

SCM3725ASA 是 YLPTEC(易川)推出的一款双向隔离数字通道收发器,提供一路正向通道与一路反向通道(1:1),专为工业现场信号隔离与数字域边界保护设计。器件支持最高10 Mbps 的数据速率,传播延迟仅约8 ns,适合常见的低速至中速串行通信与隔离接口场景。

二、主要性能参数

  • 通道数:正向 1 路,反向 1 路
  • 最大数据速率:10 Mbps
  • 默认输出电平:高电平(Power-up 默认态)
  • 隔离电压(Vrms):3750 V
  • 共模瞬变抗扰度(CMTI):100 kV/µs
  • 传播延迟(tpd):约 8 ns
  • 工作电压:VCCA、VCCB 均为 3.0 V ~ 5.5 V
  • 工作温度:-40 ℃ ~ +125 ℃
  • 封装:SOIC-8

三、特点与优势

  • 高耐压隔离:3750 Vrms 隔离等级,适合需要安全隔离与高压隔离的工业应用。
  • 强抗扰能力:100 kV/µs 的 CMTI 在强干扰环境下可保持数据完整性,降低错误触发概率。
  • 低延迟、高速传输:8 ns 的传播延迟与 10 Mbps 的带宽,兼顾响应速度与稳定性。
  • 宽供电范围:VCCA/VCCB 支持 3.0–5.5 V,方便与不同逻辑电平的主控或从设备直接接口。
  • 默认高电平输出:上电默认高电平,有助于系统上电态的确定与安全设计。

四、典型应用

  • 隔离的串口通信(UART/TTL、RS-485 等低速/中速链路)
  • 工业控制接口与传感器模块隔离
  • 电源管理与测量系统中的信号隔离
  • 需要高共模抗扰的现场总线或隔离数据采集模块

五、使用建议与注意事项

  • 电源去耦:建议在 VCCA 与 VCCB 各自靠近引脚处放置 0.1 µF 陶瓷去耦电容,并根据系统需求增加 1 µF 以上旁路电容以提高稳定性。
  • 布局与隔离保持:在 PCB 布局时保持隔离沟槽或足够的爬电/间隙距离以配合器件 3750 Vrms 的隔离能力,遵循目标应用的安全规范和 PCB 工艺标准。
  • 接地策略:VCCA 与 VCCB 两侧的地应独立处理,避免跨侧短路;如需连接,应通过受控的接口或隔离网络实现。
  • 温度与散热:器件工作温度范围为 -40 ℃~+125 ℃,在高温或高密度布板环境下注意热管理与散热设计。
  • 上电序列:尽管器件支持宽电压范围,建议参考系统整体上电策略,确保两侧电源与信号符合预期的电平和时序要求。

六、封装与采购信息

SCM3725ASA 提供标准 SOIC-8 封装,便于常规贴片加工与热回流工艺使用。产品由 YLPTEC(易川)品牌提供,适用于需可靠隔离、抗干扰及宽温度范围的工业级应用场景。

如需进一步的引脚定义、电气特性曲线、典型应用电路与 PCB 布局建议,请参考器件详细数据手册或联系 YLPTEC 技术支持。

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