WMSIC Electronic Components

YLPTEC ISO7721N1-Y ISO7721N1

ModelISO7721N1-Y
PackageSOIC-8
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC ISO7721N1-Y
Type
SOIC-8
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
ISO7721N1-Y
Electronic Component
1
Package
SOIC-8
Electronic Component
Isolated
Electronic Component
0.227g
Electronic Component
1
Channel Count
2
CMTI(kV/us)
200kV/us
Electronic Component
BM0264592680
Operating Temperature
40℃~+125℃
Output
Level
Channel Count
1
Channel Count
1
Operating Voltage(VCCA)
2.5V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ISO7721N1-Y — 两通道电容式数字隔离器产品概述

一、产品简介

ISO7721N1-Y 是易川(YLPTEC)推出的一款高性能两通道电容隔离数字隔离器,SOIC-8 封装设计。器件集成了 1 路正向通道与 1 路反向通道,提供最高 150 Mbps 的数据速率,适用于需要高安全隔离及高速数字信号传输的工业与通信场景。器件两侧供电独立,VCCA 与 VCCB 支持 2.5V 至 5.5V 宽电源范围,工作温度覆盖 -40℃ 至 +125℃,适配工业级应用。

二、主要规格亮点

  • 通道数:1 正向 + 1 反向,满足点对点或双向控制信号隔离需求
  • 最大数据速率:150 Mbps,支持高速数字接口和短帧传输
  • 默认输出:高电平(Fail-safe 高),便于系统出错时保持总线预期电平
  • 隔离电压:3750 Vrms(工频测试),满足常见工业隔离等级要求
  • 共模瞬态抗扰度(CMTI):200 kV/µs,强抗干扰能力,适合高 dv/dt 环境
  • 工作电压:VCCA / VCCB = 2.5V ~ 5.5V,支持多种逻辑电平兼容
  • 工作温度范围:-40℃ ~ +125℃(工业级)
  • 封装:SOIC-8(SOP8),便于 PCB 布局与量产焊接

三、典型应用场景

  • 工业控制与自动化:PLC、分布式 I/O、现场总线隔离
  • 电机驱动与变频器:控制信号隔离、抑制接地环路干扰
  • 电力与能源测量:电能表、采样隔离、保护电路信号传输
  • 通信接口隔离:TTL/CMOS UART、SPI 等短距离高速数字链路
  • 电动车充电与能量存储系统:控制与测量侧隔离,提升安全性与可靠性

四、设计与使用建议

  • 电源旁路:在 VCCA 与 VCCB 侧均应在近端放置 0.1µF 和 1µF 陶瓷去耦电容,以抑制电源瞬变与提高 CMTI 表现。
  • 布局注意:隔离边界两侧走线应避免交叉,保持足够爬电与间隙距离;敏感信号与高频开关电源部分分区布置。
  • 上拉/下拉:器件默认输出为高电平,若用于开漏总线(如 I2C),需外部上拉电阻并确认兼容性与时序。
  • EMC 与滤波:在强干扰环境下,可在信号输入端加小电容与串联电阻形成 RC 滤波,平衡速率与抗扰性。
  • 热管理:SOIC-8 封装散热依赖 PCB,建议在大电流或高频应用时评估 PCB 铜箔面积以改善散热。

五、器件优势总结

ISO7721N1-Y 结合高隔离电压、极高 CMTI 与宽供电范围,特别适合工业环境下对信号完整性与安全隔离有严格要求的场合。默认高电平的芯片内部失效安全设计便于系统级容错,SOIC-8 小型封装利于空间受限的应用与批量生产。对于需要在强共模干扰、高 dv/dt 条件下保持可靠数据传输的系统,ISO7721N1-Y 是一种平衡性能与成本的优选方案。

欲获取详细引脚定义、典型接线图及评估板资料,请联系易川(YLPTEC)或参考产品数据手册以完成电气与认证要求的最终设计验证。

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